Semiconductor device comprising capacitor and method of fabricating the same

ABSTRACT

Obtained are a semiconductor device which can be implemented with high density of integration while ensuring a constant capacitor capacitance in high reliability and a method of fabricating the same. The semiconductor device, including a memory cell region and a peripheral circuit region, comprises an insulating film, having an upper surface, formed on a major surface of a semiconductor substrate to extend from the memory cell region to the peripheral circuit region. A capacitor lower electrode is formed in the memory cell region to upwardly extend beyond the upper surface of the insulating film on the major surface of the semiconductor substrate. A capacitor upper electrode is formed on the capacitor lower electrode through a dielectric film, to extend onto the upper surface of the insulating film. The capacitor lower electrode includes a capacitor lower electrode part having a top surface and a bottom surface. The upper surface of the insulating film is located between the top surface and the bottom surface of the capacitor lower electrode part.

CROSS-REFERENCE TO RELATED APPLICATION

This application is related to copending application Ser. No. 08/710,901which is a continuation application of 08/253,435 and Ser. No.08/882,300 which is a continuation application of 08/157,249, commonlyassigned with the present invention.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a semiconductor device and a method offabricating the same, and more specifically, it relates to asemiconductor device comprising a capacitor and a method of fabricatingthe same.

2. Description of the Prior Art

In recent years, high integration and refinement are increasinglyrequired to a semiconductor device, particularly a semiconductor memorydevice such as a DRAM (dynamic random access memory). FIG. 114 is atypical plan view showing a part of a memory cell region of aconventional DRAM. Referring to FIG. 114, the memory cell region of theconventional DRAM comprises a capacitor including a field-effecttransistor and capacitor lower electrodes 1170 a and 1170 b, word lines1043 a, 1043 b, 1043 e and 1043 f and a bit line 1174. The field-effecttransistor is formed by the word lines 1043 a and 1043 e serving as gateelectrodes and an active region 1039 serving as a source/drain region.In more concrete terms, the active region 1039 is formed in a majorsurface of a semiconductor substrate, and the word lines 1043 a, 1043 b,1043 e and 1043 f are formed on the major surface of the semiconductorsubstrate. A first interlayer isolation film (not shown) is formed onthe word lines 1043 a, 1043 b, 1043 e and 1043 f and the major surfaceof the semiconductor substrate. The bit line 1174 is formed on the firstinterlayer isolation film substantially perpendicularly to the wordlines 1043 a, 1043 b, 1043 e and 1043 f. A second interlayer isolationfilm (not shown) is formed on the bit line 1174 and the first interlayerisolation film. The capacitor lower electrodes 1170 a and 1170 b areformed on the second interlayer isolation film. The bit line 1174 iselectrically connected with the active region 1039 through a contacthole 1049. The capacitor lower electrodes 1170 a and 1170 b areelectrically connected with single ones of source/drain regions of thefield-effect transistor in the active region 1039 through contact holes1038 a and 1038 b respectively. FIG. 115 is a sectional view of thememory cell region of the DRAM taken along the line 500—500 in FIG. 114.

FIG. 115 is a sectional view showing the section taken along the line500—500 in FIG. 114 and a section of a peripheral circuit region of theDRAM. Referring to FIG. 115, source/drain regions 1201 a and 1201 b ofthe field-effect transistor are formed on the active region 1039enclosed with a trench isolation oxide film 1040 in the memory cellregion of the DRAM. A gate electrode 1043 a is formed on a channelregion held between the pair of source/drain regions 1201 a and 1201 bthrough a gate insulating film 1042 a. A silicon nitride film 1044 a isformed on the gate electrode 1043 a. The gate electrode 1043 a consistsof n-type doped polysilicon. Side walls 1046 a and 1046 b consisting ofsilicon nitride films are formed on side surfaces of the gate electrode1043 a and the silicon nitride film 1044 a. A non-doped silicon oxidefilm 1047 is formed on the side walls 1046 a and 1046 b, the siliconnitride film 1044 a and a major surface of a semiconductor substrate1001. A gate electrode 1043 b is formed on the trench isolation oxidefilm 1040 through a gate insulating film 1042 b. A silicon nitride film1044 b is formed on the gate electrode 1043 b. Side walls 1046 c and1046 d consisting of silicon nitride films are formed on side surfacesof the gate electrode 1043 b and the silicon nitride film 1044 b. Thenon-doped silicon oxide film 1047 is formed on the side walls 1046 c and1046 d and the silicon nitride film 1044 b. A first interlayer isolationfilm 1048 is formed on the non-doped silicon oxide film 1047. Thecontact hole 1049 is formed by partially removing the first interlayerisolation film 1048 and the non-doped silicon oxide film 1047 byetching. A doped polysilicon film 1052 is formed in the contact hole1049 and on the first interlayer isolation film 1048. A refractory metalsilicide film 1053 is formed on the doped polysilicon film 1052. Thedoped polysilicon film 1052 and the refractory metal silicide film 1053form the bit line 1174. A silicon nitride film 1054 is formed on therefractory metal silicide film 1053. Side walls 1055 a and 1055 bconsisting of silicon nitride films are formed on side surfaces of thesilicon nitride film 1054, the refractory metal silicide film 1053 andthe doped polysilicon film 1052. A second interlayer isolation film 1037is formed on the first interlayer isolation film 1048, the side walls1055 a and 1055 b and the silicon nitride film 1054. The first andsecond interlayer isolation films 1048 and 1037 are partially removed,thereby forming the contact hole 1038 a for electrically connecting thecapacitor lower electrode 1170 a with one of the source/drain regions1201 a and 1201 b. A plug 1057 consisting of doped polysilicon is formedin the contact hole 1038 a. The capacitor lower electrode 1170 a isformed in the contact hole 1038 a and on the second interlayer isolationfilm 1037. The capacitor lower electrode 1170 a has a cylindricalstructure, in order to ensure the capacitance of the capacitor with asmall occupied area. A dielectric film 1150 is formed on the capacitorlower electrode 1170 a and the second interlayer isolation film 1037. Acapacitor upper electrode 1151 is formed on the dielectric film 1150. Athird interlayer isolation film 1205 is formed on the capacitor upperelectrode 1151.

The peripheral circuit region is provided with the field-effecttransistor and a wiring layer 1202 which are elements forming peripheralcircuits. Source/drain regions 1201 d and 1201 e are formed on the majorsurface of the semiconductor substrate 1001. Gate electrodes 1043 c and1043 d are formed on channel regions which are adjacent to thesource/drain regions 1201 d and 1201 e through gate insulating films1042 c and 1042 d respectively. Silicon nitride films 1044 c and 1044 dare formed on the gate electrodes 1043 c and 1043 d. Side walls 1046 eto 1046 g consisting of silicon nitride films are formed on sidesurfaces of the gate electrodes 1043 c and 1043 d and the siliconnitride films 1044 c and 1044 d. The non-doped silicon oxide film 1047is formed on the major surface of the semiconductor substrate 1001, thesilicon nitride films 1044 c and 1044 d and the side walls 1046 e to1046 g. The first interlayer isolation film 1048 is formed on thenon-doped silicon oxide film 1047. The first interlayer isolation film1048 is partially removed, thereby forming contact holes 1050 and 1051.The doped polysilicon film 1052 is formed on the first interlayerisolation film 1048 and in the contact holes 1050 and 1051. Therefractory metal silicide film 1053 is formed on the doped polysiliconfilm 1052. The doped polysilicon film 1052 and the refractory metalsilicide film 1053 form the wiring layer 1202 in the peripheral circuitregion. A silicon nitride film 1203 is formed on the refractory metalsilicide film 1053. Side walls 1204 a and 1204 b consisting of siliconnitride films are formed on side surfaces of the silicon nitride film1203, the refractory metal silicide film 1053 and the doped polysiliconfilm 1052. The second interlayer isolation film 1037 is formed on thefirst interlayer isolation film 1048, the silicon nitride film 1203 andthe side walls 1204 a and 1204 b. The dielectric film 1150 of thecapacitor extending from the memory cell region is formed on the secondinterlayer isolation film 1037. The capacitor upper electrode 1151 isformed on the dielectric film 1150. The third interlayer isolation film1205 is formed on the second interlayer isolation film 1037 and thecapacitor upper electrode 1151.

FIG. 116 illustrates a modification of the memory cell region of theconventional RAM shown in FIG. 115. This modification has a capacitorlower electrode 1092 which is in the form of a thick film. The structureof this modification is substantially identical to that of theconventional DRAM shown in FIG. 115, except the shape of the capacitorlower electrode 1092.

As shown in FIG. 115 or 116, the capacitor lower electrode 1170 a or1092 is formed to vertically extend in the memory cell region of theconventional DRAM, in order to ensure the capacitance of the capacitorwhile facilitating high integration and refinement. Thus, thecapacitance required to the capacitor can be ensured while reducing theoccupied area of the capacitor lower electrode 1170 a or 1092 in thememory cell region. However, such vertical extension of the capacitorlower electrode 1170 a or 1092 in the memory cell region results inextreme difference between the vertical positions of the upper surfaceof the third interlayer isolation film 1205 in the memory cell regionand the peripheral circuit region. In general, a wiring layer consistingof aluminum or the like is formed on the third interlayer isolation film1205. In a photolithographic step for forming this wiring layer,however, no sufficient focal allowance for photolithography can beattained due to the step on the upper surface of the third interlayerisolation film 1205 in the memory cell region and the peripheral circuitregion. Thus, the pattern of the wiring layer formed on the thirdinterlayer isolation film 1205 is so blurred that the wiring layer isdisconnected or shorted. Consequently, the semiconductor device isdisadvantageously reduced in reliability.

In the peripheral circuit region of the conventional DRAM, further,contact holes 1144 and 1135 are formed in order to electrically connectthe wiring layer 1202 and the capacitor upper electrode 1151 in theperipheral circuit region with a wiring layer (not shown) consisting ofaluminum or the like formed on the third interlayer isolation film 1205,as shown in FIG. 117. While the contact holes 1144 and 1135 aregenerally simultaneously formed in the same etching step, the capacitorupper electrode 1151 is excessively etched on a bottom portion of thecontact hole 1135 until the contact hole 1144 reaches the wiring layer1202, due to the difference between the depth positions of the capacitorupper electrode 1151 and the wiring layer 1202 formed in the peripheralcircuit region. Consequently, the contact hole 1135 may pass through thecapacitor upper electrode 1151 and the dielectric film 1150, as shown inFIG. 117. Further, the elements of the peripheral circuit region such asthe wiring layer 1202 and the field-effect transistor may be damaged bythe etching for forming the contact hole 1135. Consequently, thereliability of the semiconductor device is so reduced that the samecannot stably operate or causes a malfunction.

SUMMARY OF THE INVENTION

An object of the present invention is to provide a semiconductor devicewhich can be implemented with higher density of integration whileensuring the capacitance of the capacitor, and has high reliability.

Another object of the present invention is to provide a method offabricating a semiconductor device which can be implemented with higherdensity of integration while ensuring the capacitance of the capacitor,and has high reliability.

A semiconductor device according to a first aspect of the presentinvention includes a memory cell region and a peripheral circuit region,and comprises an insulating film, a capacitor lower electrode, adielectric film and a capacitor upper electrode, which are formed on amajor surface of a semiconductor substrate. The insulating film havingan upper surface is formed on the major surface of the semiconductorsubstrate to extend from the memory cell region to the peripheralcircuit region. The capacitor lower electrode is formed on the majorsurface of the semiconductor substrate to upwardly extend beyond theupper surface of the insulating film in the memory cell region. Thecapacitor upper electrode is formed on the capacitor lower electrodethrough the dielectric film, to extend onto the upper surface of theinsulating film. The capacitor lower electrode includes a capacitorlower electrode part upwardly extending in opposition to the capacitorupper electrode and having a top surface and a bottom surface. The uppersurface of the insulating film is located between the top surface andthe bottom surface of the capacitor lower electrode part.

Thus, the capacitor lower electrode is partially embedded in theinsulating film. Consequently, the difference between the verticalpositions of the upper surface of the insulating film extending from thememory cell region to the peripheral circuit region and the top surfaceof the capacitor lower electrode part in the memory cell region can bereduced as compared with the prior art. In case of forming an interlayerisolation film on the capacitor lower electrode and the insulating film,therefore, a step on an upper surface of this interlayer isolation filmcan be reduced between the memory cell region and the peripheral circuitregion. In case of forming a wiring layer on the insulating film byphotolithography, the pattern of this wiring layer can consequently beprevented from being blurred by such a step on the upper surface of theinterlayer isolation film. Thus, the wiring layer can be prevented fromdisconnection or shorting resulting from a blurred pattern.Consequently, the semiconductor device can be implemented with higherdensity of integration while ensuring the capacitance of the capacitorand attaining high reliability.

The capacitor lower electrode is partially embedded in the insulatingfilm, whereby the capacitor upper electrode can be formed on an outerside surface of the capacitor lower electrode part located between thetop surface of the capacitor lower electrode part and the upper surfaceof the insulating film through the dielectric film. Thus, the outer sidesurface of the capacitor lower electrode part can also be utilized asthe capacitor, thereby increasing the capacitance of the capacitor.

Further, the area of the outer side surface of the capacitor lowerelectrode part which can be utilized as the capacitor can be changed bychanging the position of the upper surface of the insulating film. Thus,the capacitance of the capacitor can be changed without changing theshape of the capacitor lower electrode part.

In the structure of the semiconductor device according to the firstaspect of the present invention, the capacitor lower electrode mayinclude first and second capacitor lower electrodes, which may be formedin the memory cell region to be adjacent to each other through a part ofthe insulating film. This part of the insulating film may have a widthwhich is smaller than the minimum working size formable byphotolithography. Thus, the distance between the first and secondcapacitor lower electrodes can be reduced as compared with the priorart. Consequently, the semiconductor device can be implemented withhigher degree of integration.

In the structure according to the first aspect of the present invention,the semiconductor device may comprise a side wall electrode part whichis formed on a side surface of the capacitor lower electrode locatedupward beyond the upper surface of the insulating film. Thus, thesurface area of the side surface of the capacitor lower electrode can beincreased as compared with the prior art, thereby increasing thecapacitance of the capacitor. Therefore, the occupied area of thecapacitor lower electrode can be reduced as compared with the prior artwhile ensuring a constant capacitor capacitance. Consequently, thesemiconductor device can be further refined.

In the structure according to the first aspect of the present invention,the semiconductor device may comprise a first wiring layer and a firstinterlayer isolation film. The first wiring layer may be formed on themajor surface of the semiconductor substrate in a region located underthe capacitor lower electrode, and the first interlayer isolation filmmay be formed to be in contact with the first wiring layer and thecapacitor lower electrode part on the first wiring layer. Thus, thenumber of layers formed in the memory cell region can be reduced ascompared with the case of forming a protective insulating film forprotecting the first wiring layer between the first wiring layer and thefirst interlayer isolation film. Therefore, the vertical position of thetop surface of the capacitor lower electrode part can be lowered in thememory cell region. In case of forming an interlayer isolation film onthe capacitor lower electrode and the insulating film, therefore, a stepon the upper surface of the interlayer isolation film between the memorycell region and the peripheral circuit region can be reduced. In case offorming a wiring layer on the interlayer isolation film byphotolithography, the pattern of this wiring layer can consequently beprevented from being blurred by such a step on the upper surface of theinterlayer isolation film. Thus, the wiring layer can be prevented fromdisconnection or shorting resulting from a blurred pattern.

In the structure according to the first aspect of the present invention,the semiconductor device may further comprise a first conductive region,a second interlayer isolation film, a second wiring layer and aconnecting conductor film. The first conductive region may be formed onthe major surface of the semiconductor substrate in a region locatedunder the capacitor lower electrode, and the second interlayer isolationfilm may be formed on the first conductive region with a first contacthole exposing a surface of the first conductive region. The secondwiring layer may be formed on the second interlayer isolation film, andthe connecting conductor film may be formed in the first contact hole toelectrically connect the first conductive region with the second wiringlayer. The second wiring layer may have a width smaller than that of thefirst contact hole.

Thus, the semiconductor device can be refined as compared with thegeneral case of forming the second wiring layer in a width completelycovering the first contact hole.

In the structure according to the first aspect of the present invention,the semiconductor device may further comprise a second conductiveregion, a third interlayer isolation film, a third wiring layer, a wireprotection film and a conductor film. The second conductive region maybe formed on the major surface of the semiconductor substrate in aregion located under the capacitor lower electrode, and the thirdinterlayer isolation film may be formed on the second conductive regionwith a second contact hole exposing a surface of the second conductiveregion. The conductor film may be formed in the second contact hole toelectrically connect the second conductive region with the capacitorlower electrode, and the wire protection film may be in contact with thecapacitor lower electrode or the conductor film.

Thus, the wire protection film can be employed as a mask for etching forforming the second contact hole in a fabrication step for thesemiconductor device. Therefore, no step of forming a resist patternindependently employed as a mask is required for forming the secondcontact hole, and the number of fabrication steps for the semiconductordevice can be reduced.

In the structure according to the first aspect of the present invention,the semiconductor device may further comprise a fourth interlayerisolation film and a peripheral circuit element protection film. Thecapacitor upper electrode may be formed to extend toward the peripheralcircuit region, and the fourth interlayer isolation film may be formedon the capacitor upper electrode with a third contact hole exposing asurface of the capacitor upper electrode. The peripheral circuit elementprotection film may be formed under the insulating film in a regionlocated under the third contact hole.

Thus, the peripheral circuit element protection film can inhibitprogress of etching even if the third contact hole passes through thecapacitor upper electrode and reaches the insulating film in formationof the third contact hole by etching. Therefore, peripheral circuitelements such as a field-effect transistor and a wiring layer in theperipheral circuit region can be prevented from damage caused by etchingfor forming the third contact hole. Thus, the semiconductor device canbe prevented from a defective operation resulting from damage of theelements of the peripheral circuit region. Consequently, a highlyreliable semiconductor device can be obtained.

In the structure according to the first aspect of the present invention,the semiconductor device may further comprise a peripheral circuitinsulating film and a fourth interlayer isolation film. The peripheralcircuit insulating film may have a peripheral circuit region opening inthe peripheral circuit region, and the capacitor upper electrode may beformed to extend into the peripheral circuit region opening. The fourthinterlayer isolation film may be formed on the peripheral circuit regionopening with a fourth contact hole exposing a surface of the capacitorupper electrode.

Therefore, the depth of the fourth contact hole may be changed to reducethe difference between the same and that of another contact hole in theperipheral circuit region by adjusting the depth of the peripheralcircuit region opening and the thickness of the capacitor upperelectrode. Thus, the fourth contact hole can be prevented from passingthrough the capacitor upper electrode to damage peripheral circuitelements such as a field-effect transistor and a wiring layer due todifference between the depths of the fourth contact hole and the othercontact hole in the peripheral circuit region. Thus, the semiconductordevice can be prevented from a defective operation such as a malfunctionresulting from damage of the peripheral circuit elements. Consequently,a highly reliable semiconductor device can be obtained.

In the structure according to the first aspect of the present invention,the semiconductor device may further comprise a fourth interlayerisolation film and a peripheral circuit element. The capacitor upperelectrode may be formed to extend toward the peripheral circuit region,and the fourth interlayer isolation film may be formed on the capacitorupper electrode with a fifth contact hole exposing a surface of thecapacitor upper electrode. The peripheral circuit element may be formedunder the insulating film in the peripheral circuit region. The fifthcontact hole may be formed in a region not overlapping with theperipheral circuit element in plane.

Thus, the peripheral circuit element can be prevented from damage causedby etching even if the etching so progresses that the fifth contact holepasses through the capacitor upper electrode in formation of the fifthcontact hole. Therefore, the semiconductor device can be prevented froma defective operation such as a malfunction resulting from damage of theperipheral circuit element. Consequently, a highly reliablysemiconductor device can be obtained.

A semiconductor device according to a second aspect of the presentinvention includes a memory cell region and a peripheral circuit region,and comprises a semiconductor substrate having a major surface, aninsulating film, a capacitor lower electrode, a dielectric film and acapacitor upper electrode. The insulating film is formed on the majorsurface of the semiconductor substrate to extend from the memory cellregion to the peripheral circuit region. The capacitor lower electrode,including first and second capacitor lower electrodes, is formed on themajor surface of the semiconductor device to extend to a verticalposition substantially identical to that of an upper surface of theinsulating film. The first and second capacitor lower electrodes areadjacent to each other through a part of the insulating film. Thecapacitor upper electrode is formed on the capacitor lower electrodethrough the dielectric film, to extend toward the upper surface of theinsulating film. The capacitor lower electrode includes a capacitorlower electrode part upwardly extending in opposition to the capacitorupper electrode and having a top surface and a bottom surface. The partof the insulating film has a width which is smaller than the minimumworking size formable by photolithography.

Thus, the overall capacitor lower electrode is embedded in theinsulating film. Therefore, formation of a step resulting from thecapacitor lower electrode can be prevented on the upper surface of theinsulating film formed in the memory cell region and the peripheralcircuit region. In case of forming an interlayer isolation film on thecapacitor lower electrode part and the insulating film, therefore,formation of a step on an upper surface of the interlayer isolation filmcan be prevented between the memory cell region and the peripheralcircuit region. In case of forming a wiring layer on the interlayerisolation film by photolithography, the pattern of this wiring layer canconsequently be prevented from being blurred by such a step on the uppersurface of the interlayer isolation film. Thus, the wiring layer can beprevented from disconnection or shorting resulting from a blurredpattern. Consequently, the semiconductor device can be implemented withhigher density of integration while ensuring the capacitance of thecapacitor and attaining high reliability.

The width of the part of the insulating film provided between the firstand second capacitor lower electrodes is smaller than the minimumworking size formable by photolithography, whereby the distance betweenthe first and second capacitor lower electrodes can be reduced ascompared with the prior art. Consequently, the semiconductor device canbe implemented with higher density of integration.

In the structure of the semiconductor device according to the secondaspect of the present invention, a side surface of the capacitor lowerelectrode may have a curved plane.

Thus, the surface area of the side surface of the capacitor lowerelectrode can be increased as compared with a flat side surface of aconventional capacitor lower electrode. Therefore, the occupied area ofthe capacitor can be reduced while ensuring a constant capacitorcapacitance. Consequently, the semiconductor device can be furtherrefined.

In the structure of the semiconductor device according to the secondaspect of the present invention, the insulating film may include upperand lower insulating films which are different in etching rate from eachother.

In case of carrying out a step of reducing the width of the part of theinsulating film to be smaller than the minimum working size formable byphotolithography through etching in a fabrication step described later,therefore, only a part of a side surface of the lower insulating filmforming the part of the insulating film can be removed by etchingthrough an etching condition for selectively removing the lowerinsulating film. Thus, the width of the part of the insulating film canbe reduced while leaving the upper insulating film substantiallyunetched. In the etching step of reducing the width of the part of theinsulating film, therefore, an upper surface of the upper insulatingfilm can be prevented from being removed by etching. Consequently, thevertical position of a side surface of the capacitor lower electrodeformed in a later step can be prevented from being lowered. As a result,the surface area of the capacitor lower electrode can be prevented frombeing reduced, thereby preventing reduction of the capacitance of thecapacitor.

In the structure according to the first or second aspect of the presentinvention, the semiconductor device may comprise the dielectric filmwhich is formed between at least either the side surface or only a partof the bottom surface of the capacitor lower electrode part and theinsulating film. Thus, the side surface or the part of the bottomsurface of the capacitor lower electrode part can be utilized as acapacitor. Therefore, the capacitance of the capacitor can be increasedwithout changing the shape of the capacitor lower electrode.

In a step of fabricating the semiconductor device, a clearance isdefined in a region for forming the dielectric film, in order to formthe dielectric film between at least either the side surface or the partof the bottom surface of the capacitor lower electrode part and theinsulating film. In the step of defining the clearance, another part ofthe bottom surface of the capacitor lower electrode part can be kept incontact with another layer such as the insulating film. In case ofcleaning the semiconductor substrate provided with the semiconductordevice while defining the clearance, therefore, the insulating film orthe like which is in contact with the other part of the bottom surfaceof the capacitor lower electrode part serves as a reinforcing memberagainst a physical impact or the like. Thus, the capacitor lowerelectrode can be prevented from partial breaking caused by an impactsuch as vibration in the cleaning step. Consequently, the semiconductordevice can be prevented from a malfunction resulting from a defect suchas partial breaking of the capacitor lower electrode, and a highlyreliably semiconductor device can be obtained.

In the structure according to the first or second aspect of the presentinvention, the semiconductor device may comprise granular crystals atleast on a part of the surface of the capacitor lower electrode or theside wall electrode part. Thus, the surface area of the capacitor lowerelectrode can be increased without increasing its occupied area.Therefore, the capacitance of the capacitor can be increased. Thus, theoccupied area of the capacitor lower electrode can be reduced ascompared with the prior art while ensuring the capacitance of thecapacitor. Consequently, the semiconductor device can be furtherrefined.

In a method of fabricating a semiconductor device including a memorycell region and a peripheral circuit region according to a third aspectof the present invention, an insulating film having an upper surface isfirst formed on a major surface of a semiconductor substrate to extendfrom the memory cell region to the peripheral circuit region. Then, theinsulating film is partially removed by etching in the memory region,thereby forming an opening. Then, a capacitor lower electrode is formedin the opening on the major surface of the semiconductor substrate.Then, a capacitor upper electrode is formed on the capacitor lowerelectrode through a dielectric film, to extend onto the upper surface ofthe insulating film. The step of forming the capacitor lower electrodeincludes a step of forming a capacitor lower electrode part upwardlyextending in opposition to the capacitor upper electrode and having atop surface and a bottom surface. The step of forming the insulatingfilm includes a step of locating the upper surface of the insulatingfilm between the top surface and the bottom surface of the capacitorlower electrode.

Thus, the capacitor lower electrode can be partially embedded in theinsulating film. Thus, the difference between the vertical positions ofthe upper surface of the insulating film extending from the memory cellregion to the peripheral circuit region and the top surface of thecapacitor lower electrode part in the memory cell region can be reducedas compared with the prior art. In case of forming an interlayerisolation film on the capacitor lower electrode part and the insulatingfilm, therefore, a step on an upper surface of the interlayer isolationfilm can be reduced between the memory cell region and the peripheralcircuit region. In case of forming a wiring layer on the interlayerisolation film by photolithography, the pattern of this wiring layer canconsequently be prevented from being blurred by such a step on the uppersurface of the interlayer isolation film. Thus, the wiring layer can beprevented from disconnection or shorting resulting from a blurredpattern. Consequently, the semiconductor device can be implemented withhigher density of integration while ensuring the capacitance of thecapacitor and attaining high reliability.

The capacitor lower electrode can be partially embedded in theinsulating film, whereby the capacitor upper electrode can be formed onan outer side surface of the capacitor lower electrode part locatedbetween the top surface of the capacitor lower electrode part and theupper surface of the insulating film through the dielectric film. Thus,the outer side surface of the capacitor lower electrode part can beutilized as a capacitor, thereby increasing the capacitance of thecapacitor.

Further, the area of the outer side surface of the capacitor lowerelectrode part utilized as a capacitor can be changed by changing theposition of the upper surface of the insulating film. Thus, thecapacitance of the capacitor can be controlled without changing theshape of the capacitor lower electrode.

In the method of fabricating a semiconductor device according to thethird aspect of the present invention, the step of forming theinsulating film may include steps of forming a lower insulating film andforming an upper insulating film which is different in etching rate fromthe lower insulating film on the lower insulating film. The step oflocating the upper surface of the insulating film between the topsurface and the bottom surface of the capacitor lower electrode part mayinclude a step of removing the upper insulating film.

Thus, the position of the upper surface of the insulating film can bearbitrarily changed by changing the thickness of the upper insulatingfilm. Therefore, the area of the outer side surface of the capacitorlower electrode part utilized as a capacitor can be changed.Consequently, the capacitance of the capacitor can be changed withoutchanging the shape of the capacitor lower electrode.

In the method of fabricating a semiconductor device according to thethird aspect of the present invention, the step of locating the uppersurface of the insulating film between the top surface and the bottomsurface of the capacitor lower electrode part may include a step ofpartially removing the insulating film by etching.

Thus, the position of the upper surface of the insulating film can bearbitrarily changed by changing the thickness of the part of theinsulating film removed by etching in the step of partially removing theinsulating film by etching. Therefore, the area of the outer sidesurface of the capacitor lower electrode part utilized as a capacitorcan be changed. Consequently, the capacitance of the capacitor can bechanged without changing the shape of the capacitor lower electrode.

In the method of fabricating a semiconductor device according to thethird aspect of the present invention, a conductive region may be formedon the major surface of the semiconductor substrate in a region locatedunder the capacitor lower electrode. Then, an interlayer isolation filmmay be formed on the conductive region, and a wiring layer may be formedon the interlayer isolation film. A wire protection film may be formedon the wiring layer, and a contact hole may be formed by removing atleast a part of the interlayer isolation film by etching, in order toelectrically connect the conductive region with the capacitor lowerelectrode. The wire protection film may be employed as a part of a maskemployed for etching in the step of forming the contact hole.

Thus, a step of forming a resist pattern independently employed as amask for forming the contact hole can be omitted. Thus, the number offabrication steps for the semiconductor device can be reduced.

The foregoing and other objects, features, aspects of the presentinvention and advantages of the present invention will become moreapparent from the following detailed description of the presentinvention when taken in conjunction with the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a typical plan view showing a memory cell region of a DRAMaccording to an embodiment 1 of the present invention;

FIG. 2 is a sectional view showing the memory cell region and aperipheral circuit region of the DRAM according to the embodiment 1 ofthe present invention;

FIGS. 3 to 13 are sectional views for illustrating first to eleventhsteps of a method of fabricating the DRAM according to the embodiment 1of the present invention shown in FIG. 2;

FIGS. 14 and 15 are sectional views for illustrating first and secondsteps of a modification of the method of fabricating the DRAM accordingto the embodiment 1 of the present invention shown in FIG. 2;

FIG. 16 is a sectional view for illustrating a first modification of theDRAM according to the embodiment 1 of the present invention;

FIG. 17 is a sectional view for illustrating a second modification ofthe DRAM according to the embodiment 1 of the present invention;

FIGS. 18 to 20 are sectional views for illustrating first to third stepsof a method of fabricating the second modification of the DRAM accordingto the embodiment 1 of the present invention shown in FIG. 17;

FIG. 21 is a sectional view for illustrating a third modification of theDRAM according to the embodiment 1 of the present invention;

FIGS. 22 to 24 are sectional views for illustrating first to third stepsof a method of fabricating the third modification of the DRAM accordingto the embodiment 1 of the present invention shown in FIG. 21;

FIG. 25 is a sectional view for illustrating a fourth modification ofthe DRAM according to the embodiment 1 of the present invention;

FIG. 26 is a sectional view for illustrating a first step of a method offabricating the fourth modification of the DRAM according to theembodiment 1 shown in FIG. 25;

FIG. 27 is a sectional view for illustrating a DRAM according to anembodiment 2 of the present invention;

FIGS. 28 and 29 are sectional views for illustrating first and secondsteps of a method of fabricating the DRAM according to the embodiment 2of the present invention shown in FIG. 27;

FIG. 30 is a sectional view for illustrating a first modification of theDRAM according to the embodiment 2 of the present invention;

FIGS. 31 and 32 are sectional views for illustrating first and secondsteps of a method of fabricating the first modification of the DRAMaccording to the embodiment 2 of the present invention shown in FIG. 30;

FIG. 33 is a sectional view for illustrating a second modification ofthe DRAM according to the embodiment 2 of the present invention;

FIG. 34 is a sectional view for illustrating a first step of a method offabricating the second modification of the DRAM according to theembodiment 2 of the present invention shown in FIG. 33;

FIG. 35 is a sectional view for illustrating a third modification of theDRAM according to the embodiment 2 of the present invention;

FIG. 36 is a sectional view for illustrating a first step of a method offabricating the third modification of the DRAM according to theembodiment 2 of the present invention shown in FIG. 35;

FIG. 37 is a sectional view for illustrating a fourth modification ofthe DRAM according to the embodiment 2 of the present invention;

FIG. 38 is a sectional view for illustrating a first step of a method offabricating the fourth modification of the DRAM according to theembodiment 2 of the present invention shown in FIG. 37;

FIG. 39 is a sectional view for illustrating a DRAM according to anembodiment 3 of the present invention;

FIGS. 40 to 42 are sectional views for illustrating first to third stepsof a method of fabricating the DRAM according to the embodiment 3 of thepresent invention shown in FIG. 39;

FIG. 43 is a sectional view for illustrating a first modification of theDRAM according to the embodiment 3 of the present invention;

FIGS. 44 to 46 are sectional views for illustrating first to third stepsof a method of fabricating the first modification of the DRAM accordingto the embodiment 3 of the present invention shown in FIG. 43;

FIG. 47 is a sectional view for illustrating a second modification ofthe DRAM according to the embodiment 3 of the present invention;

FIGS. 48 and 49 are sectional views for illustrating first and secondsteps of a method of fabricating the second modification of the DRAMaccording to the embodiment 3 of the present invention shown in FIG. 47;

FIG. 50 is a sectional view for illustrating the structure of a DRAMaccording to an embodiment 4 of the present invention;

FIGS. 51 to 55 are sectional views for illustrating first to fifth stepsof a method of fabricating the DRAM according to the embodiment 4 of thepresent invention shown in FIG. 50;

FIG. 56 is a sectional view for illustrating a first modification of theDRAM according to the embodiment 4 of the present invention;

FIG. 57 is a sectional view for illustrating a first step of a method offabricating the first modification of the DRAM according to theembodiment 4 of the present invention shown in FIG. 56;

FIG. 58 is a sectional view for illustrating a second modification ofthe DRAM according to the embodiment 4 of the present invention;

FIG. 59 is a sectional view for illustrating a first step of a method offabricating the second modification of the DRAM according to theembodiment 4 of the present invention shown in FIG. 58;

FIG. 60 is a sectional view for illustrating a third modification of theDRAM according to the embodiment 4 of the present invention;

FIGS. 61 to 63 are sectional views for illustrating first to third stepsof a method of fabricating the third modification of the DRAM accordingto the embodiment 4 of the present invention shown in FIG. 60;

FIG. 64 is a sectional view for illustrating a fourth modification ofthe DRAM according to the embodiment 4 of the present invention;

FIG. 65 is a sectional view for illustrating a first step of a method offabricating the fourth modification of the DRAM according to theembodiment 4 of the present invention shown in FIG. 64;

FIG. 66 is a sectional view for illustrating the structure of a DRAMaccording to an embodiment 5 of the present invention;

FIGS. 67 to 69 are sectional views for iltustrating first to third stepsof a method of fabricating the DRAM according to the embodiment 5 of thepresent invention shown in FIG. 66;

FIG. 70 is a sectional view showing a modification of the DRAM accordingto the embodiment 5 of the present invention;

FIG. 71 is a sectional view for illustrating a first step of a method offabricating the modification of the DRAM according to the embodiment 5of the present invention shown in FIG. 70;

FIG. 72 is a sectional view for illustrating the structure of a DRAMaccording to an embodiment 6 of the present invention;

FIGS. 73 to 77 are sectional views for illustrating first to fifth stepsof a method of fabricating the DRAM according to the embodiment 6 of thepresent invention shown in FIG. 72;

FIG. 78 is a sectional view showing a first modification of the DRAMaccording to the embodiment 6 of the present invention;

FIG. 79 is a sectional view showing a second modification of the DRAMaccording to the embodiment 6 of the present invention;

FIG. 80 is a sectional view for illustrating a first step of a method offabricating the second modification of the DRAM according to theembodiment 6 of the present invention shown in FIG. 79;

FIG. 81 is a sectional view showing a third modification of the DRAMaccording to the embodiment 6 of the present invention;

FIG. 82 is a sectional view showing a fourth modification of the DRAMaccording to the embodiment 6 of the present invention;

FIG. 83 is a sectional view showing a fifth modification of the DRAMaccording to the embodiment 6 of the present invention;

FIG. 84 is a sectional view showing a sixth modification of the DRAMaccording to the embodiment 6 of the present invention;

FIG. 85 is a typical plan view of a memory cell of a DRAM according toan embodiment 7 of the present invention;

FIG. 86 is a sectional view of the DRAM according to the embodiment 7 ofthe present invention;

FIG. 87 is a sectional view showing a modification of the DRAM accordingto the embodiment 7 of the present invention;

FIG. 88 is a sectional view showing a DRAM according to an embodiment 8of the present invention;

FIG. 89 is a sectional view showing a first modification of the DRAMaccording to the embodiment 8 of the present invention;

FIG. 90 is a sectional view showing a second modification of the DRAMaccording to the embodiment 8 of the present invention;

FIG. 91 is a sectional view showing a third modification of the DRAMaccording to the embodiment 8 of the present invention;

FIG. 92 is a sectional view showing a first modification of a wire ofthe DRAM according to the embodiment 8 of the present invention;

FIGS. 93 to 96 are sectional views for illustrating first to fourthsteps of a method of fabricating the first modification of the wire ofthe DRAM according to the embodiment 8 of the present invention shown inFIG. 92;

FIGS. 97 to 100 are sectional views for illustrating first to fourthfabrication steps of a modification of the method of fabricating thefirst modification of the wire of the DRAM according to the embodiment 8of the present invention shown in FIG. 92;

FIG. 101 is a sectional view showing a second modification of the wireof the DRAM according to the embodiment 8 of the present invention;

FIGS. 102 to 104 are sectional views for illustrating first to thirdsteps of a method of fabricating the second modification of the wire ofthe DRAM according to the embodiment 8 of the present invention shown inFIG. 101;

FIG. 105 is a sectional view showing a third modification of the wire ofthe DRAM according to the embodiment 8 of the present invention;

FIG. 106 is a sectional view showing a fourth modification of the wireof the DRAM according to the embodiment 8 of the present invention;

FIG. 107 is a sectional view showing a fifth modification of the wire ofthe DRAM according to the embodiment 8 of the present invention;

FIGS. 108 to 112 are sectional views for illustrating first to fifthsteps of a method of fabricating the fifth modification of the wire ofthe DRAM according to the embodiment 8 of the present invention shown inFIG. 107;

FIG. 113 is a sectional view showing a sixth modification of the wire ofthe DRAM according to the embodiment 8 of the present invention;

FIG. 114 is a typical plan view showing a memory cell region of aconventional DRAM;

FIG. 115 is a sectional view of the conventional DRAM;

FIG. 116 is a sectional view of another conventional DRAM;

FIG. 117 is a sectional view showing a contact hole passing through acapacitor upper electrode in a peripheral circuit region of theconventional DRAM;

FIG. 118 is a sectional view of a conventional wire;

FIGS. 119 and 120 are sectional views for illustrating first and secondsteps of fabricating the conventional wire shown in FIG. 118;

FIG. 121 is a sectional view showing another conventional wire; and

FIGS. 122 to 124 are sectional views for illustrating first to thirdsteps of a method of fabricating the conventional wire shown in FIG.121.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

Embodiments of the present invention are now described with reference tothe drawings.

Embodiment 1

Referring to FIG. 1, a memory cell region of a DRAM according to anembodiment 1 of the present invention includes an active region 39formed on a major surface of a semiconductor substrate, word lines 43 a,43 b, 43 e and 43 f formed on the major surface of the semiconductorsubstrate for serving also as gate electrodes of field-effecttransistors, a bit line 174, and a capacitor including capacitor lowerelectrodes 170 a and 170 b. The bit line 174 is electrically connectedwith the active region 39 through a contact hole 49. FIG. 2 is asectional view of this memory cell region taken along the line 500—500in FIG. 1.

With reference to FIG. 2, the structure of the DRAM according to theembodiment 1 of the present invention is now described.

Referring to FIG. 2, source/drain regions 201 a to 201 c of thefield-effect transistors are formed on the active region 39 enclosedwith a trench isolation oxide film 40 in the memory cell region of theDRAM according to the embodiment 1 of the present invention. A gateelectrode 43 a is formed on a channel region held between the pair ofsource/drain regions 201 a and 201 b through a gate insulating film 42a. The gate insulating film 42 a is formed by a thermal oxide film, asilicon nitride film or an oxi-nitride film. The gate electrode 43 a maybe formed by a film of refractory metal such as tungsten or titanium, ora film of polysilicon or amorphous silicon doped with phosphorus orarsenic, or a silicide film thereof, or may be in a multilayer structureobtained by overlapping these materials with each other. A siliconnitride film 44 a is formed on the gate electrode 43 a. Side walls 46 aand 46 b consisting of silicon nitride films are formed on side surfacesof the gate electrode 43 a and the silicon nitride film 44 a. Anon-doped silicon oxide film 47 is formed on the side wall 46 a and thesilicon nitride film 44 a.

A gate electrode 43 b is formed on the trench isolation oxide film 40through a gate insulating film 42 b. A silicon nitride film 44 b isformed on the gate electrode 43 b. Side walls 46 c and 46 d consistingof silicon nitride films are formed on side surfaces of the gateelectrode 43 b and the silicon nitride film 44 b. The non-doped siliconoxide film 47 is formed on the side wall 46 d and the silicon nitridefilm 44 b. A first interlayer isolation film 48 is formed on thenon-doped silicon oxide film 47. The first interlayer isolation film 48and the non-doped silicon oxide film 47 are partially removed byetching, thereby forming a contact hole 49. A doped polysilicon film 52is formed in the contact hole 49 and on the first interlayer isolationfilm 48. A refractory metal silicide film 53 is formed on the dopedpolysilicon film 52. The doped polysilicon film 52 and the refractorymetal silicide film 53 form the bit line 174. A silicon nitride film 54is formed on the refractory metal silicide film 53. Side walls 55 a and55 b consisting of silicon nitride films are formed on side surfaces ofthe silicon nitride film 54, the refractory metal silicide film 53 andthe doped polysilicon film 52. A second interlayer isolation film 37 isformed on the first interlayer isolation film 48, the side walls 55 aand 55 b and the silicon nitride film 54.

The first and second interlayer isolation films 48 and 37 and thenon-doped silicon oxide film 47 are partially removed, thereby forming acontact hole 38 a for electrically connecting the capacitor lowerelectrode 170 a with one of the source/drain regions 201 a and 201 b. Aplug 57 consisting of doped polysilicon is formed in the contact hole 38a. A silicon nitride film 58 is formed on the second interlayerisolation film 37. The capacitor lower electrode 170 a is formed on theplug 57 and the second interlayer isolation film 37. This capacitorlower electrode 170 a has a cylindrical structure, in order to ensurethe capacitance of the capacitor with a small occupied area. A thirdinterlayer isolation film 59 is formed on the silicon nitride film 58and side surfaces of the capacitor lower electrode 170 a. An uppersurface of the third interlayer isolation film 59 is formed to belocated between a top surface 301 and a bottom surface 302 of acapacitor lower electrode part which is a side surface portion of thecylindrical capacitor lower electrode 170 a. A dielectric film 150 isformed on the capacitor lower electrode 170 a and the third interlayerisolation film 59. A capacitor upper electrode 151 is formed on thedielectric film 150. A fourth interlayer isolation film 205 is formed onthe capacitor upper electrode 151.

In the peripheral circuit region of the DRAM according to the embodiment1 of the present invention, a field-effect transistor and a wiring layer202 are formed on the major surface of the semiconductor substrate 1. Inmore concrete terms, source/drain regions 201 d and 201 e are formed onthe major surface of the semiconductor substrate 1. Gate electrodes 43 cand 43 d are formed on channel regions which are adjacent to thesource/drain regions 201 d and 201 e through gate insulating films 42 cand 42 d. Silicon nitride films 44 c and 44 d are formed on the gateelectrodes 43 c and 43 d. Side walls 46 e to 46 g consisting of siliconnitride films are formed on side surfaces of the gate electrodes 43 cand 43 d and the silicon nitride films 44 c and 44 d. The non-dopedsilicon oxide film 47 is formed on the major surface of thesemiconductor substrate 1, the silicon nitride films 44 c and 44 d andthe side walls 46 e to 46 g. The first interlayer isolation film 48 isformed on the non-doped silicon oxide film 47. The first interlayerisolation film 48, the non-doped silicon oxide film 47 and the siliconnitride film 44 c are partially removed, thereby forming contact holes50 and 51. The doped polysilicon film 52 is formed on the firstinterlayer isolation film 48 and in the contact holes 50 and 51. Therefractory metal silicide film 53 is formed on the doped polysiliconfilm 52. The doped polysilicon film 52 and the refractory metal silicidefilm 53 form the wiring layer 202 in the peripheral circuit region.

A silicon nitride film 203 is formed on the refractory metal silicidefilm 53. Side walls 204 a and 204 b consisting of silicon nitride filmsare formed on side surfaces of the silicon nitride film 203 and thewiring layer 202. The second interlayer isolation film 37 is formed onthe first interlayer isolation film 48, the silicon nitride film 203 andthe side walls 204 a and 204 b. The silicon nitride film 58 is formed onthe second interlayer isolation film 37. The third interlayer isolationfilm 59 is formed on the silicon nitride film 58. The dielectric film150 of the capacitor extending from the memory cell region is formed onthe third interlayer isolation film 59. The capacitor upper electrode151 is formed on the dielectric film 150. The fourth interlayerisolation film 205 is formed on the third interlayer isolation film 59and the capacitor upper electrode 151, to extend from the memory cellregion.

Thus, the capacitor lower electrode 170 a is partially embedded in thethird interlayer isolation film 59 in the DRAM according to theembodiment 1 of the present invention. Therefore, the difference betweenthe vertical positions of the upper surface of the third interlayerisolation film 59 and the top surface 301 of the capacitor lowerelectrode 170 a can be reduced. In case of forming the fourth interlayerisolation film 205, therefore, a step on an upper surface of the fourthinterlayer isolation film 205 between the memory cell region and theperipheral circuit region can be reduced as compared with the prior art.In case of forming a wiring layer consisting of aluminum or the like onthe fourth interlayer isolation film 205, therefore, the pattern of thiswiring layer can be prevented from being blurred by such a step on theupper surface of the fourth interlayer isolation film 205. Thus, thiswiring layer can be prevented from disconnection or shorting resultingfrom an unclear pattern. Consequently, the semiconductor device can beimplemented with higher density of integration while ensuring thecapacitance of the capacitor and attaining high reliability.

In the DRAM according to the embodiment 1 of the present invention,further, the capacitor lower electrode 170 a is partially embedded inthe third interlayer isolation film 59, whereby the dielectric film 150and the capacitor upper electrode 151 can be formed also on outer sidesurfaces of the capacitor lower electrode 170 a. Therefore, the outerside surfaces of the capacitor lower electrode 170 a can also beutilized as the capacitor, whereby the capacitance of the capacitor canbe increased.

Further, the areas of the outer side surfaces of the capacitor lowerelectrode 170 a utilized as the capacitor can be changed by changing theposition of the upper surface of the third interlayer isolation film 59.Thus, the capacitance of the capacitor can be changed without changingthe shape of the capacitor lower electrode 170 a.

With reference to FIGS. 3 to 13, steps of fabricating the DRAM accordingto the embodiment 1 of the present invention are now described.

Referring to FIG. 3, the trench isolation oxide film 40 is formed on themajor surface of the semiconductor substrate 1 in the memory cell regionof the DRAM according to the embodiment 1 of the present invention. Aninsulating film (not shown) for defining the gate insulating films 42 aand 42 b is formed on the major surface of the semiconductor substrate1. A polysilicon film (not shown) is formed on this insulating film. Asilicon nitride film (not shown) is formed on this polysilicon film. Aresist pattern (not shown) is formed on this silicon nitride film, andthereafter employed as a mask for partially removing the insulatingfilm, the doped polysilicon film and the silicon nitride film byanisotropic etching. Thereafter the resist pattern is removed, therebyforming the gate insulating films 42 a and 42 b, the gate electrodes 43a and 43 b and the silicon nitride films 44 a and 44 b shown in FIG. 3.An impurity is injected into the active region 39 of the semiconductorsubstrate 1 through the silicon nitride films 44 a and 44 b serving asmasks, thereby forming the source/drain regions 201 a to 201 c of thefield-effect transistors. Thereafter the overall surface of thesemiconductor substrate 1 is oxidized in a dry atmosphere at atemperature of not more than 900° C., thereby forming an oxide film (notshown) having a thickness of about 50 to 100 Å on the side surfaces ofthe silicon nitride films 44 a and 44 b and the gate electrodes 43 a and43 b and the major surface of the semiconductor substrate 1. Thereafterthe silicon nitride film 45 is formed to cover the overall surface.

Also in the peripheral circuit region, the source/drain regions 201 dand 201 e of the field effect transistor, the gate insulating films 42 cand 42 d, the gate electrodes 43 c and 43 d and the silicon nitridefilms 42 c, 42 d and 45 are formed on the semiconductor substrate 1through steps similar to those carried out in the memory cell region.

Then, the silicon nitride film 45 is partially removed by anisotropicetching, thereby forming the side walls 46 a to 46 g on the sidesurfaces of the silicon nitride films 44 a to 44 d, the gate electrodes43 a to 43 d and the gate insulating films 42 a to 42 d. The non-dopedsilicon oxide film 47 is formed to cover the overall surface, as shownin FIG. 4. The first interlayer isolation film 48 consisting of aphosphorus-doped silicon oxide film is formed on the non-doped siliconoxide film 47. The non-doped silicon oxide film 47 and the firstinterlayer isolation film 48 consisting of the phosphorus-doped siliconoxide film are formed by low-pressure or ordinary-pressure CVD. Whilethe non-doped silicon oxide film 47 and the first interlayer isolationfilm 48 consisting of the phosphorus-doped silicon oxide film are formedin this step, the first interlayer isolation film 48 may be formed byeither material. After formation of the first interlayer isolation film48, its surface is flattened by chemical mechanical polishing (CMP) or areflow method.

Then, a resist pattern (not shown) is formed on the first interlayerisolation film 48 and thereafter employed as a mask for partiallyremoving the first interlayer isolation film 48 and the non-dopedsilicon oxide film 47 by etching, thereby forming the contact hole 49 asshown in FIG. 5. In this step, the contact hole 49 may be formed in aself-alignment manner through the silicon nitride film 44 a formed onthe gate electrode 43 a and the side wall 46 a serving as parts of themask for etching.

Then, a resist pattern (not shown) is formed on the first interlayerisolation film 48 in the peripheral circuit region and thereafteremployed as a mask for partially removing the first interlayer isolationfilm 48, the non-doped silicon oxide film 47 and the silicon nitridefilm 44 c, thereby forming the contact holes 50 and 51 as shown in FIG.6. Thereafter the resist pattern is removed.

Then, a doped polysilicon film (not shown) is formed in the contactholes 49, 50 and 51 and on the first interlayer isolation film 48. Arefractory metal silicide film (not shown) is formed on the dopedpolysilicon film. A silicon nitride film (not shown) is formed on therefractory metal silicide film. A resist pattern (not shown) is formedon the silicon nitride film, and employed as a mask for partiallyremoving the silicon nitride film, the refractory metal silicide filmand the doped polysilicon film by etching, thereby forming the dopedpolysilicon film 52 and the refractory metal silicide film 53 formingthe bit line 174 and the silicon nitride film 54, as shown in FIG. 7.Further, the doped polysilicon film 52 and the refractory metal silicidefilm 53 forming the wiring layer 202 in the peripheral circuit regionand the silicon nitride film 203 are formed in a similar manner. Then, asilicon nitride film (not shown) is formed to cover the overall surfaceand thereafter partially removed by anisotropic etching, thereby formingthe side walls 55 a, 55 b, 204 a and 204 b. Thus, the structure shown inFIG. 7 is obtained.

Then, the second interlayer isolation film 37 (see FIG. 8) consisting ofthe phosphorus-doped silicon oxide film is formed on the firstinterlayer isolation film 48, the silicon nitride films 54 and 203 andthe side walls 55 a, 55 b, 204 a and 204 b. A resist pattern (not shown)is formed on the second interlayer isolation film 37 and thereafteremployed as a mask for partially removing the second interlayerisolation film 37, the first interlayer isolation film 48 and thenon-doped silicon oxide film 47 by etching, thereby forming the contacthole 38 a (see FIG. 8). The contact hole 38 a may be formed by reactiveion etching (hereinafter referred to as RIE). Further, the side walls 46b and 46 c may be employed as parts of the mask for forming the contacthole 38 a in a self-alignment manner. Thereafter the polysilicon film 56is formed in the contact hole 38 a and on the second interlayerisolation film 37 by CVD. The polysilicon film 56 may be replaced withan amorphous silicon film. Thus, the structure shown in FIG. 8 isobtained.

Then, the polysilicon film 56 located on the second interlayer isolationfilm 37 is removed by CMP or dry etching. Thus, the structure shown inFIG. 9 is obtained.

Then, the silicon nitride film 58 (see FIG. 10) is formed to cover theoverall surface. The third interlayer isolation film 59 (see FIG. 10)consisting of a silicon oxide film is formed on the silicon nitride film58. A boron-doped silicon oxide film 60 (see FIG. 10) is formed on thethird interlayer isolation film 59. The boron-doped silicon oxide film60 may be replaced with a phosphorus-doped silicon oxide film. A resistpattern (not shown) is formed on the boron-doped silicon oxide film 60and thereafter employed as a mask for partially removing the boron-dopedsilicon oxide film 60 and the third interlayer isolation film 59,thereby forming an opening 61 (see FIG. 10). A part of the siliconnitride film 58 located on a bottom portion of the opening 61 is removedwith a phosphoric acid solution or by dry etching. Thereafter the resistpattern is removed. Thus, the structure shown in FIG. 10 is obtained.The opening 61 may be formed by RIE.

Then, a polysilicon film 62 (see FIG. 11) is formed to cover the overallsurface. This polysilicon film 62 may be replaced with an amorphoussilicon film. Thus, the structure shown in FIG. 11 is obtained.

A resist 70 (see FIG. 12) is formed on the polysilicon film 62 locatedin the opening 61. Thereafter the polysilicon film 62 located on theboron-doped silicon oxide film 60 is removed by dry etching. Thus, thecapacitor lower electrode 170 a is isolated as shown in FIG. 12. Thepolysilicon film 62 (see FIG. 11) located on the boron-doped siliconoxide film 60 may be removed by CMP.

Then, the boron-doped silicon oxide film 60 is removed by vapor-phaseHF, thereby obtaining the structure shown in FIG. 13. While thecapacitor lower electrode 170 a is prepared from polysilicon oramorphous silicon, a film consisting of a metal such as platinum orruthenium, a refractory metal such as titanium, titanium nitride or afilm consisting a plurality of layers of these materials may be employedin case of employing a high dielectric film of BST or PZT as thedielectric film 150 of the capacitor.

Thereafter the dielectric film 150 (see FIG. 2) is formed on thecapacitor lower electrode 170 a and the third interlayer isolation film59. The capacitor upper electrode 151 (see FIG. 2) is formed on thedielectric film 150. The fourth interlayer isolation film 205 (see FIG.2) is formed on the capacitor upper electrode 151 and the thirdinterlayer isolation film 59, thereby obtaining the structure shown inFIG. 2.

With reference to FIGS. 14 and 15, a modification of the method offabricating the DRAM according to the embodiment 1 of the presentinvention is now described.

Following a fabrication step identical to the seventh step for the DRAMaccording to the embodiment 1 of the present invention shown in FIG. 9,the silicon nitride film 58 (see FIG. 14), the third interlayerisolation film 59 (see FIG. 14) and the boron-doped silicon oxide film60 (see FIG. 14) are formed. Then, a polysilicon film 141 (see FIG. 14)is formed on the boron-doped silicon oxide film 60. A resist pattern(not shown) is formed on the polysilicon film 141 and employed as a maskfor partially removing the polysilicon film 141 by anisotropic etching.Thereafter the resist pattern is removed. The polysilicon film 141 isemployed as a mask for partially removing the boron-doped silicon oxidefilm 60 and the third interlayer isolation film 59, thereby forming theopening 61. The silicon nitride film 58 is removed from the bottomportion of the opening 61, thereby obtaining the structure shown in FIG.14. A conductive film such as the polysilicon film 141 is employed asthe mask for forming the opening 61 by etching, whereby a mask patterncan be formed in higher accuracy as compared with the case of employinga resist or the like for the mask. Thus, the semiconductor device can beimplemented with higher density of integration.

Thereafter the polysilicon film 62 is formed in the opening 61 and onthe polysilicon film 141, as shown in FIG. 15. Following this step,fabrication steps identical to those for the DRAM according to theembodiment 1 of the present invention shown in FIGS. 11 to 13 arecarried out.

Referring to FIG. 16, a first modification of the DRAM according to theembodiment 1 of the present invention is basically similar in structureto the DRAM according to the embodiment 1 shown in FIG. 2. In the firstmodification of the DRAM according to the embodiment 1 of the presentinvention, however, granular crystals 74 consisting of silicon areformed on surfaces of a capacitor lower electrode 170 a. In order toform the granular crystals 74, the capacitor lower electrode 170 a isprepared from amorphous silicon doped with phosphorus or arsenic ornon-doped amorphous silicon, and nuclei of silicon are bonded tosurfaces of exposed parts of the capacitor lower electrode 170 a byutilizing SiH₄ gas as a part of atmosphere gas in a heating furnace.Thereafter PH₃ gas is introduced as a part of the atmosphere gas andperforming annealing at a high temperature, thereby forming the granularcrystals 74. In case of preparing the capacitor lower electrode 170 afrom non-doped amorphous silicon, phosphorus or arsenic may beintroduced into the capacitor lower electrode 170 a by ion implantationor a vapor phase method after forming the granular crystals 74. Due tosuch formation of the granular crystals 74 on the surfaces of thecapacitor lower electrode 170 a, the surface area of the capacitor lowerelectrode 170 a can be increased. Thus, the capacitance of the capacitorcan be increased. Therefore, the occupied area of the capacitor lowerelectrode 170 a can be reduced while ensuring a constant capacitorcapacitance. Consequently, the semiconductor device can be furtherrefined.

In order to fabricate the first modification of the DRAM according tothe embodiment 1, the granular crystals 74 are formed on the surfaces ofthe capacitor lower electrode 170 a by the aforementioned method after afabrication step identical to that for the DRAM according to theembodiment 1 shown in FIG. 13. Thereafter a dielectric film 150 (seeFIG. 16), a capacitor upper electrode 151 (see FIG. 16) and a fourthinterlayer isolation film 205 (see FIG. 16) are formed throughfabrication steps identical to those for the DRAM according to theembodiment 1, thereby obtaining the structure shown in FIG. 16.

Referring to FIG. 17, a second modification of the DRAM according to theembodiment 1 of the present invention is basically similar in structureto the DRA according to the embodiment 1 shown in FIG. 2. In the secondmodification, however, granular crystals 74 are formed on inner sidesurfaces and a bottom surface of a capacitor lower electrode 170 a.Thus, the second modification of the DRAM according to the embodiment 1is provided with the granular crystals 74 similarly to the firstmodification shown in FIG. 16, whereby the surface area of the capacitorlower electrode 170 a can be increased. Therefore, an effect similar tothat of the first modification shown in FIG. 16 can be attained.

With reference to FIGS. 18 to 20, a method of fabricating the secondmodification of the DRAM according to the embodiment 1 of the presentinvention is now described.

Following a fabrication step identical to that for the DRAM according tothe embodiment 1 of the present invention shown in FIG. 11, the granularcrystals 74 are formed on a polysilicon film 62, as shown in FIG. 18.

Thereafter a resist 74 (see FIG. 19) is formed on the granular crystals74 in an opening 61, and thereafter the granular crystals 74 and thepolysilicon film 62 located on a boron-doped silicon oxide film 60 areremoved. Thus, the structure shown in FIG. 19 is obtained.

Then, the resist 70 is removed, and the boron-doped silicon oxide film60 is removed by vapor-phase HF. Thus, the structure shown in FIG. 20 isobtained.

Thereafter a dielectric film 150 (see FIG. 17), a capacitor upperelectrode 151 (see FIG. 17) and a fourth interlayer isolation film 205(see FIG. 17) are formed through fabrication steps similar to those forthe DRAM according to the embodiment 1 of the present invention, therebyobtaining the structure shown in FIG. 17.

Referring to FIG. 21, a third modification of the DRAM according to theembodiment 1 of the present invention is basically similar in structureto the second modification shown in FIG. 17. In the third modification,however, an upper portion of a third interlayer isolation film 77 isremoved by etching or the like as described later, thereby obtaining thestructure shown in FIG. 21.

With reference to FIGS. 22 to 24, a method of fabricating the thirdmodification of the DRAM according to the embodiment 1 of the presentinvention is described.

First, fabrication steps identical to those for the DRAM according tothe embodiment 1 of the present invention shown in FIGS. 3 to 9 arecarried out, and then a silicon nitride film 58 (see FIG. 22) is formedon a second interlayer isolation film,37 (see FIG. 22). Thereafter thethird interlayer isolation film 77 (see FIG. 22) is formed on thesilicon nitride film 58. A resist pattern (not shown) is formed on thethird interlayer isolation film 77, and thereafter employed as a maskfor partially removing the third interlayer isolation film 77 and thesilicon nitride film 58, thereby forming an opening 61 (see FIG. 22). Apolysilicon film 62 (see FIG. 22) is formed in the opening 61 and on thethird interlayer isolation film 77. Granular crystals 74 (see FIG. 22)are formed on a surface of the polysilicon film 62. Thus, the structureshown in FIG. 22 is obtained.

Then, a resist 70 (see FIG. 23) is formed on the granular crystals 74located in the opening 61, and thereafter the polysilicon film 62 andthe granular crystals 74 located on the third interlayer isolation film77 are removed by dry etching. Thus, the structure shown in FIG. 23 isobtained.

Then, the resist 70 is removed, and the third interlayer isolation film77 is partially removed by an HF aqueous solution. Thus, the structureshown in FIG. 24 is obtained. The third interlayer isolation film 77 isthus partially removed by the HF aqueous solution, whereby the thicknessof the removed part of the third interlayer isolation film 77 can becontrolled by controlling the time for bringing the third interlayerisolation film 77 into contact with the HF aqueous solution. Thus, theareas of exposed parts can be changed in outer side surfaces of acapacitor lower electrode 170 a. Consequently, it is possible to controlthe capacitance of the capacitor by changing the areas of the outer sidesurfaces of the capacitor lower electrode 170 a utilized as thecapacitor.

Thereafter a dielectric film 150 (see FIG. 21) and the like are formedsimilarly to the fabrication steps for the DRAM according to theembodiment 1, thereby obtaining the structure shown in FIG. 21.

Referring to FIG. 25, a fourth modification of the DRAM according to theembodiment 1 of the present invention is basically substantially similarin structure to the third modification of the DRAM according to theembodiment 1 shown in FIG. 21. In the fourth modification, however, athird interlayer isolation film 77 (see FIG. 21) is substantiallyentirely removed. Granular crystals 74 are formed on inner side surfacesof a capacitor lower electrode 170 a, thereby lowering the verticalposition of the capacitor lower electrode 170 a with reference to anupper surface of a second interlayer isolation film 37. Thus, a step onan upper surface of a fourth interlayer isolation film 205 is reducedbetween a memory cell region and a peripheral circuit region.

With reference to FIG. 26, a method of fabricating the fourthmodification of the DRAM according to the embodiment 1 of the presentinvention is now described.

In the method of fabricating the fourth modification of the DRAMaccording to the embodiment 1 of the present invention, the thirdinterlayer isolation film 77 (see FIG. 23) is substantially entirelyremoved by etching after a fabrication step identical to that for thethird modification shown in FIG. 23. Thus, the structure shown in FIG.26 is obtained.

Thereafter a dielectric film 150 (see FIG. 25) and the like are formed,thereby obtaining the structure shown in FIG. 25.

Embodiment 2

Referring to FIG. 27, a DRAM according to an embodiment 2 of the presentinvention is basically similar in structure to the DRAM according to theembodiment 1 of the present invention shown in FIG. 2. In the DRAMaccording to the embodiment 2 of the present invention, however, acapacitor lower electrode 92 is in the form of a thick film. Thecapacitor lower electrode 92 is partially embedded in a third interlayerisolation film 59, whereby the difference between the vertical positionsof upper surfaces of the third interlayer isolation film 59 and thecapacitor lower electrode 92 can be reduced as compared with the priorart. Thus, a step in an upper surface of a fourth interlayer isolationfilm 205 can be reduced between a memory cell region and a peripheralcircuit region as compared with the prior art. Further, the surface areaof the capacitor lower electrode 92 serving as a capacitor can bechanged by changing the position of the upper surface of the thirdinterlayer isolation film 59, thereby arbitrarily changing thecapacitance of the capacitor.

With reference to FIGS. 28 and 29, a method of fabricating the DRAMaccording to the embodiment 2 of the present invention is described.

First, fabrication steps identical to those for the DRAM according tothe embodiment 1 of the present invention shown in FIGS. 3 to 10 arecarried out, and thereafter a polysilicon film 91 is formed in anopening 61 and on a boron-doped silicon oxide film 60, as shown in FIG.28.

Then, the polysilicon film 91 located on the boron-doped silicon oxidefilm 60 is removed by dry etching or CMP. Then, the boron-doped siliconoxide film 60 is removed by vapor-phase HF. Thus, the structure shown inFIG. 29 is obtained.

Thereafter a dielectric film 150 (see FIG. 27), a capacitor upperelectrode 151 (see FIG. 27) and the fourth interlayer isolation film 205(see FIG. 27) are formed, thereby obtaining the structure shown in FIG.27. The peripheral circuit region is formed by steps identical to thosefor the peripheral circuit region of the DRAM according to theembodiment 1 of the present invention shown in FIGS. 3 to 13.

Referring to FIG. 30, a first modification of the DRAM according to theembodiment 2 of the present invention is basically similar in structureto the DRAM according to the embodiment 2 shown in FIG. 27. In the firstmodification, however, side walls 96 and 97 consisting of polysiliconare formed on upper side surfaces of a capacitor lower electrode 92.Surfaces of these side walls 96 and 97 have curved parts. Therefore, thesurface area of the capacitor lower electrode 92 serving as a capacitorcan be increased as compared with the case of forming no side walls 96and 97. Thus, the occupied area of the capacitor lower electrode 92 canbe reduced as compared with the prior art while ensuring the capacitanceof the capacitor. Consequently, the semiconductor device can be furtherrefined.

With reference to FIGS. 31 and 32, a method of fabricating the secondmodification of the DRAM according to the embodiment 2 of the presentinvention is now described.

Fabrication steps identical to those for the DRAM according to theembodiment 2 of the present invention shown in FIGS. 28 and 29 arecarried out, and thereafter an amorphous silicon film 95 is formed on athird interlayer isolation film 59 and the capacitor lower electrode 92,as shown in FIG. 31.

Then, the amorphous silicon film 95 is partially removed by anisotropicetching, thereby forming the side walls 96 and 97 as shown in FIG. 32.

Thereafter a dielectric film 150 (see FIG. 30), a capacitor upperelectrode 151 (see FIG. 30) and a fourth interlayer isolation film 205(see FIG. 30) are formed, thereby obtaining the structure shown in FIG.30.

Referring to FIG. 33, a second modification of the DRAM according to theembodiment 2 of the present invention is basically similar in structureto the DRAM according to the embodiment shown in FIG. 27. In the secondmodification, however, granular crystals 74 are formed on the surface ofa capacitor lower electrode 92 located upward beyond a third interlayerisolation film 59. Therefore, the surface area of the capacitor lowerelectrode 92 can be increased without increasing its occupied area.Thus, the capacitance of the capacitor can be increased.

With reference to FIG. 34, a method of fabricating the secondmodification of the DRAM according to the embodiment 2 of the presentinvention is now described.

First, fabrication steps identical to those for the DRAM according tothe embodiment 2 of the present invention shown in FIGS. 28 and 29 arecarried out, and thereafter the granular crystals 74 are formed on thesurfaces of the capacitor lower electrode 92 as shown in FIG. 34. Thesegranular crystals 74 are formed by a method similar to that employed inthe first or second modification of the DRAM according to the embodiment1 of the present invention.

Thereafter a dielectric film 150 (see FIG. 33) and the like are formed,thereby obtaining the structure shown in FIG. 33.

Referring to FIG. 35, a third modification of the DRAM according to theembodiment 2 of the present invention is basically similar in structureto the first modification of the DRAM according to the embodiment 2shown in FIG. 30. In the third modification, however, granular crystals98 consisting of silicon are formed on surfaces of side walls 96 and 97consisting of amorphous silicon. In the third modification, therefore,the surface area of a capacitor lower electrode 92 can be increased byformation of the side walls 96 and 97 as well as by the granularcrystals 98. Thus, the capacitance of the capacitor can be furtherincreased.

With reference to FIG. 36, a method of fabricating the thirdmodification of the DRAM according to the embodiment 2 of the presentinvention is now described.

First, fabrication steps identical to those for the first modificationof the DRAM according to the embodiment 2 of the present invention shownin FIGS. 31 and 32 are carried out, and thereafter the granular crystals98 are formed on the surfaces of the side walls 96 and 97 through a stepidentical to that for forming the granular crystals 74 (see FIG. 33) inthe second modification of the DRAM shown in FIG. 33.

Thereafter a dielectric film 150 (see FIG. 35) and the like are formed,thereby obtaining the structure shown in FIG. 35.

Referring to FIG. 37, a fourth modification of the DRAM according to theembodiment 2 of the present invention is basically similar in structureto the first modification of the DRAM according to the embodiment 2shown in FIG. 30. In the fourth modification, however, granular crystals98 are formed on surfaces of a capacitor lower electrode 92 and sidewalls 96 and 97. Therefore, the surface area of the capacitor lowerelectrode 92 can be increased as compared with the case of forming noside walls 96 and 97 and granular crystals 98, thereby furtherincreasing the capacitance of the capacitor. Thus, the occupied area ofthe capacitor lower electrode 92 can be reduced as compared with theprior art while ensuring a constant capacitor capacitance. Consequently,the semiconductor device can be further refined.

With reference to FIG. 38, a method of fabricating the fourthmodification of the DRAM according to the embodiment 2 of the presentinvention shown in FIG. 37 is now described.

First, fabrication steps identical to those for the first modificationof the DRAM according to the embodiment 2 of the present invention shownin FIGS. 31 and 32 are carried out. At this time, the capacitor lowerelectrode 92 is prepared from amorphous silicon. Then, the granularcrystals 98 are formed on the surfaces of the capacitor lower electrode92 and the side walls 96 and 97 as shown in FIG. 38, through a stepidentical to that for the second modification of the embodiment 1 of thepresent invention shown in FIG. 18.

Thereafter a dielectric film 150 (see FIG. 37) and the like are formed,thereby obtaining the structure shown in FIG. 37.

Embodiment 3

Referring to FIG. 39 showing a section taken along the line 600—600 inFIG. 1, a trench isolation oxide film 40 is formed on a major surface ofa semiconductor substrate 1 to enclose an active region 39 in a memorycell region of a DRAM according to an embodiment 3 of the presentinvention. Source/drain regions 201 a to 201 c are formed on the majorsurface of the semiconductor substrate 1. Gate electrodes 43 a, 43 b and43 e are formed on channel regions adjacent to the source/drain regions201 a to 201 c through gate insulating films 42 a, 42 b and 42 e.Silicon nitride films 44 a, 44 b and 44 e are formed on the gateelectrodes 43 a, 43 b and 43 e. Side walls 46 a to 46 d, 46 h and 46 iare formed on side surfaces of the gate insulating films 42 a, 42 b and42 e, the gate electrodes 43 a, 43 b and 43 e and the silicon nitridefilms 44 a, 44 b and 44 e. A non-doped silicon oxide film 47 is formedon the silicon nitride films 44 a, 44 b and 44 e, the side walls 46 a to46 d, 46 h and 46 i and the major surface of the semiconductor substrate1. A first interlayer isolation film 48 is formed on the non-dopedsilicon oxide film 47. A second interlayer isolation film 37 is formedon the first interlayer isolation film 48. The first and secondinterlayer isolation films 48 and 37 and the non-doped silicon oxidefilm 47 are partially removed, thereby forming contact holes 38 a and 38b. Plugs 57 a and 57 b consisting of polysilicon are formed in thecontact holes 38 a and 38 b respectively. A silicon nitride film 58 isformed on a part of an upper surface of the second interlayer isolationfilm 37. Capacitor lower electrodes 170 a and 170 b are formed on theplugs 57 a and 57 b and the second interlayer isolation film 37. A thirdinterlayer isolation film 77 is formed on sides of the capacitor lowerelectrodes 170 a and 170 b. Granular crystals 74 are formed on innerside surfaces of the capacitor lower electrodes 170 a and 170 b. Adielectric film 150 of a capacitor is formed on the granular crystals 74and the third interlayer isolation film 77. A capacitor upper electrode151 is formed on the dielectric film 150. A fourth interlayer isolationfilm 205 is formed on the capacitor upper electrode 151. The width W2 ofa part of the third interlayer isolation film 77 located between thecapacitor lower electrodes 170 a and 170 b is smaller than the minimumworking size formable by photolithography.

A section of a peripheral circuit region of the DRAM according to theembodiment 3 of the present invention is basically similar in structureto that of the peripheral circuit region of the DRAM according to theembodiment 1 shown in FIG. 2.

In the DRAM according to the embodiment 3 of the present invention, ashereinabove described, top surfaces of the capacitor lower electrodes170 a and 170 b and the upper surface of the third interlayer isolationfilm 77 are substantially flush with each other as shown in FIG. 39,whereby the fourth interlayer isolation film 205 can be prevented fromformation of a step on its upper surface between the memory cell regionand the peripheral circuit region. In case of forming a wiring layer onthe fourth interlayer isolation film 205 by photolithography, therefore,the pattern of the wiring layer can be prevented from being blurred bysuch a step. Thus, the wiring layer can be prevented from disconnectionor shorting resulting from a blurred pattern. Consequently, thesemiconductor device can be implemented with higher density ofintegration while ensuring the capacitance of the capacitor andattaining high reliability. Further, the width W2 of the thirdinterlayer isolation film 77 is smaller than the minimum working sizeformable by photolithography, whereby the interval between the capacitorlower electrodes 107 a and 107 b can be reduced as compared with theprior art. Consequently, the semiconductor device can be implementedwith higher density of integration. Also in each of the embodiments 1and 2, a similar effect can be attained by reducing the width of theinterlayer isolation film between the capacitor lower electrodes ascompared with the minimum working size formable by photolithography,similarly to the embodiment 3.

With reference to FIGS. 40 to 42, a method of fabricating the DRAMaccording to the embodiment 3 of the present invention is now described.

First, a trench isolation oxide film 40 (see FIG. 40) is formed on themajor surface of the semiconductor substrate 1 (see FIG. 40) in thememory cell region of the DRAM according to the embodiment 3 of thepresent invention. A silicon oxide film (not shown) for defining thegate insulating films 42 a, 42 b and 42 e is formed on the major surfaceof the semiconductor substrate 1. A polysilicon film (not shown) fordefining the gate electrodes 43 a, 43 b and 43 e is formed on thesilicon oxide film. A silicon nitride film (not shown) is formed on thepolysilicon film. A resist pattern is formed on the silicon nitride filmand employed as a mask for etching the silicon nitride film, thepolysilicon film and the silicon oxide film, thereby forming the gateinsulating films 42 a, 42 b and 42 e, the gate electrodes 43 a, 43 b and43 e and the silicon nitride films 44 a, 44 b and 44 e (see FIG. 40). Asilicon nitride film (not shown) is formed to cover the overall surface,and thereafter anisotropically etched for forming the side walls 46 a to46 d, 46 h and 46 i (see FIG. 40). Then, a non-doped silicon oxide film47 (see FIG. 40) is formed to cover the overall surface. The firstinterlayer isolation film 48 (see FIG. 40) consisting of aphosphorus-doped silicon oxide film is formed on the non-doped siliconoxide film 47. The second interlayer isolation film 37 (see FIG. 40) isformed on the first interlayer isolation film 48. A resist pattern isformed on the second interlayer isolation film 37 and thereafteremployed as a mask for partially removing the first and secondinterlayer isolation films 48 and 37 and the non-doped silicon oxidefilm 47, thereby forming the contact holes 38 a and 38 b (see FIG. 40).The plugs 57 a and 57 b consisting of polysilicon are formed in thecontact holes 38 a and 38 b. The silicon nitride film 58 (see FIG. 40)is formed on the second interlayer isolation film 37 and the plugs 57 aand 57 b. The third interlayer isolation film 77 consisting of a siliconoxide film is formed on the silicon nitride film 58. A resist pattern isformed on the third interlayer isolation film 77 and thereafter employedas a mask for partially removing the third interlayer isolation film 77and the silicon nitride film 58, thereby forming openings 61 a and 61 b.Thus, the structure shown in FIG. 40 is obtained. It is assumed thatsymbol L1 denotes the width of the opening 61 a, and symbol W1 denotesthe width of the part of the third interlayer isolation film 77 locatedbetween the openings 61 a and 61 b.

Then, a surface of the third interlayer isolation film 77 is partiallyremoved by wet etching with an aqueous solution of alkali or acid. Thus,the width of the opening 61 a increases from L1 to L2 (see FIG. 41),while the width of the part of the third interlayer isolation film 77located between the openings 61 a and 61 b reduces from W1 to W2 (seeFIG. 41). Thus, the structure shown in FIG. 41 is obtained.

Then, an amorphous silicon film (not shown) is formed on the thirdinterlayer isolation film 77 and in the openings 61 a and 61 b throughfabrication steps identical to those for the third modification of theDRAM according to the embodiment 1 of the present invention shown inFIGS. 22 and 23. Then, granular crystals 74 (see FIG. 42) are formed onthe amorphous silicon film. The amorphous silicon film and the granularcrystals 74 located on the upper surface of the third interlayerisolation film 77 are removed by dry etching or the like, therebyobtaining the structure shown in FIG. 42.

Thereafter a dielectric film 150 (see FIG. 39) and the like are formedon the granular crystals 74 and the third interlayer isolation film 77,thereby obtaining the structure shown in FIG. 39. The peripheral circuitregion is formed through fabrication steps identical to those for theperipheral circuit region of the DRAM according to the embodiment 1 ofthe present invention shown in FIGS. 3 to 13.

Referring to FIG. 43, a first modification of the DRAM according to theembodiment 3 of the present invention is basically similar in structureto the DRAM according to the embodiment 3 shown in FIG. 39. In the firstmodification of the DRAM according to the embodiment 3 of the presentinvention shown in FIG. 43, however, a non-doped silicon oxide film 85and a boron-doped silicon oxide film 86 form a third interlayerisolation film. Thus, the third interlayer isolation film has atwo-layer structure, whereby the widths of openings 61 a and 61 b can beincreased by etching only the boron-doped silicon oxide film 86 byvapor-phase HF without etching the upper non-doped silicon oxide film 85in a fabrication step described later. Thus, the upper surface of thethird interlayer isolation film can be prevented from being removed byetching in the step of increasing the widths of the openings 61 a and 61b and reducing the width of a part of the third interlayer isolationfilm located therebetween. Thus, the vertical positions of side surfacesof capacitor lower electrodes 170 a and 170 b thereafter formed can beprevented from lowering. Consequently, the surface areas of thecapacitor lower electrodes 170 a and 170 b can be prevented from beingreduced, thereby preventing reduction of the capacitance of thecapacitor.

With reference to FIGS. 44 to 46, a method of fabricating the firstmodification of the DRAM according to the embodiment 3 of the presentinvention is now described.

First, the structure shown in FIG. 44 is obtained by a fabrication stepbasically similar to that for the DRAM according to the embodiment 3shown in FIG. 40. While the third interlayer isolation film 77 has aone-layer structure in the step shown in FIG. 40, the boron-dopedsilicon oxide film 86 is formed on a silicon nitride film 58 andthereafter the non-doped silicon oxide film 85 is formed on theboron-doped silicon oxide film 86 to form the interlayer isolation filmin the step shown in FIG. 44. It is assumed that symbol L1 denotes thewidth of the opening 61 a and symbol W1 denotes the width of the part ofthe third interlayer isolation film located between the openings 61 aand 61 b.

Then, only side surfaces of the boron-doped silicon oxide film 86 areremoved by etching through vapor-phase HF, as shown in FIG. 45. Thus,the width of the opening 61 a increases from L1 to L2, so that the widthof the part of the third interlayer isolation film located between theopenings 61 a and 61 b can be reduced to W2 from the initial width W1.

Then, the capacitor lower electrodes 170 a and 170 b and the granularcrystals 74 are formed in the openings 61 a and 61 b as shown in FIG.46, through a step identical to that for forming the capacitor lowerelectrodes 170 a and 170 b (see FIG. 42) and the granular crystals 74(see FIG. 42) for the DRAM according to the embodiment 3 of the presentinvention shown in FIG. 42.

Thereafter a dielectric film 150 (see FIG. 43) and the like are formed,thereby obtaining the structure shown in FIG. 43.

Referring to FIG. 47, a second modification of the DRAM according to theembodiment 3 of the present invention is basically similar in structureto the DRAM according to the embodiment 3 shown in FIG. 39. In thesecond modification of the DRAM according to the embodiment 3 of thepresent invention shown in FIG. 47, however, side surfaces of capacitorlower electrodes 170 a and 170 b have curved planes. Therefore, thesurface areas of the side surfaces of the capacitor lower electrodes 170a and 170 b can be increased as compared with the capacitor lowerelectrodes 170 a and 170 b having flat side surfaces shown in FIG. 39.Thus, the occupied area of the capacitor can be reduced as compared withthe prior art while ensuring a constant capacitor capacitance, wherebythe semiconductor device can be further refined.

With reference to FIGS. 48 and 49, a method of fabricating the secondmodification of the DRAM according to the embodiment 3 of the presentinvention is now described.

First, a fabrication step identical to the first step of fabricating theDRAM according to the embodiment 3 shown in FIG. 40 is carried out.However, a third interlayer isolation film 77 (see FIG. 48) isdry-etched under a high-pressure atmosphere. Thus, the side surfaces ofthe third interlayer isolation film 77 located in the openings 61 a and61 b can be formed to have curved planes. In this etching step, thevolume of etching gas mixed into the atmosphere gas for forming filmsfor protecting the side surfaces of the third interlayer isolation film77 may be reduced. The etching gas employed in this etching step may beprepared from CHF₃/CF₄ gas. In this case, it is effective to increasethe flow rate of CF₄ for forming the curved planes, and it is alsoeffective to mix gas of O₂ or the like.

Then, the capacitor lower electrodes 170 a and 170 b and granularcrystals 74 are formed in the openings 61 a and 61 b as shown in FIG.49, similarly to the fabrication step for the DRAM according to theembodiment 3 of the present invention shown in FIG. 42.

Thereafter a dielectric film 150 (see FIG. 47) and the like are formed,thereby obtaining the structure shown in FIG. 47. The formation of thecurved planes on the side surfaces of the capacitor lower electrodes 170a and 170 b can be applied to the capacitor lower electrode 170 a of theDRAM according to the embodiment 1 shown in FIGS. 1 to 26 as well as tothe cylindrical capacitor lower electrode 92 of the DRAM according tothe embodiment 2, to attain similar effects.

Embodiment 4

FIG. 50 shows a section of a memory cell region taken along the line500—500 in the typical plan view of the memory cell region of the DRAMshown in FIG. 1. A DRAM according to an embodiment 4 of the presentinvention shown in FIG. 50 is basically similar in structure to the DRAMaccording to the embodiment 1 shown in FIG. 2. In the DRAM according tothe embodiment 4, however, clearances are defined between a capacitorlower electrode 170 a and a third interlayer isolation film 77 in afabrication step described later, so that a dielectric film 150 and acapacitor upper electrode 151 are formed in these clearances. Further,an upper surface of the third interlayer isolation film 77 is formed tobe substantially flush with a top surface of the capacitor lowerelectrode 170 a. Thus, the clearances are defined between the capacitorlower electrode 170 a and the third interlayer isolation film 77 in thefabrication step described later in the DRAM according to the embodiment4 of the present invention, whereby side surfaces of the capacitor lowerelectrode 170 a can be utilized as a capacitor. Thus, the capacitance ofthe capacitor can be increased without changing the shape of thecapacitor lower electrode 170 a.

Further, the third interlayer isolation film 77 is formed to extend fromthe memory cell region to a peripheral circuit region. In case offorming a fourth interlayer isolation film on the capacitor upperelectrode 151 in the memory cell region and the peripheral circuitregion, therefore, no step is formed on an upper surface of the fourthinterlayer isolation film between the memory cell region and theperipheral circuit region. In addition, the clearances are defined onlyon the side surfaces of the capacitor lower electrode 170 a in thefabrication step described later, whereby a bottom surface of thecapacitor lower electrode 170 a is regularly in contact with the secondinterlayer isolation film 37 regardless of the clearances. In a step ofcleaning a semiconductor substrate provided with the clearances,therefore, the bottom surface of the capacitor lower electrode 170 a isin contact with the second interlayer isolation film 37, which serves asa reinforcing member against a physical impact. Thus, the capacitorlower electrode 170 a is prevented from breaking by a physical impact inthe aforementioned cleaning step or the like.

The structure shown in the embodiment 4 can be applied to theembodiments 1 to 3, to attain similar effects.

With reference to FIGS. 51 to 55, a method of fabricating the DRAMaccording to the embodiment 4 of the present invention is now described.

First, fabrication steps identical to those for the DRAM according tothe embodiment 1 of the present invention shown in FIGS. 3 to 9 arecarried out, and a silicon nitride film 58 (see FIG. 51) and the thirdinterlayer isolation film 77 (see FIG. 51) are formed on a secondinterlayer isolation film 37 (see FIG. 51). A resist pattern (not shown)is formed on the third interlayer isolation film 77, and thereafteremployed as a mask for partially removing the third interlayer isolationfilm 77 by anisotropic etching, thereby forming an opening 61 (see FIG.51). The silicon nitride film 58 is removed from a bottom portion of theopening 61 by etching. Alternatively, the width of the opening 61 may beincreased by etching, similarly to the fabrication step for the DRAMaccording to the embodiment 3 of the present invention shown in FIG. 39.In this case, an effect similar to that of the embodiment 3 can beattained. Thereafter a silicon nitride film 99 (see FIG. 51) is formedon the third interlayer isolation film 77 and in the opening 61. Thus,the structure shown in FIG. 51 is obtained. Alternatively, the siliconnitride film 99 may be formed on the third interlayer isolation film 77and in the opening 61 without removing the silicon nitride film 58 fromthe bottom portion of the opening 61.

Then, the silicon nitride film 99 is partially removed by anisotropicetching for forming side walls 100 consisting of silicon nitride filmsin the opening 61, thereby obtaining the structure shown in FIG. 52.

Then, a conductor film 101 of polysilicon or amorphous silicon is formedon the third interlayer isolation film 77 and in the opening 61, asshown in FIG. 53.

Then, a part of the conductor film 101 located on the third interlayerisolation film 77 is removed by etching or the like, similarly to theembodiment 1. Thus, the structure shown in FIG. 54 is obtained. Throughthis step, the capacitor lower electrode 170 a is isolated every bit.

Then, the side walls 100 consisting of silicon nitride films areselectively removed by etching, thereby defining the clearances betweenthe capacitor lower electrode 170 a and the third interlayer isolationfilm 77. Thus, the structure shown in FIG. 55 is obtained.

Thereafter a dielectric film 150 (see FIG. 50) and the like are formed,thereby obtaining the structure shown in FIG. 50. The peripheral circuitregion is formed through fabrication steps identical to those for theperipheral circuit region of the DRAM according to the embodiment 1 ofthe present invention shown in FIGS. 3 to 13.

Referring to FIG. 56, a first modification of the DRAM according to theembodiment 4 of the present invention is basically similar in structureto the DRAM according to the embodiment 4 shown in FIG. 50. In the firstmodification, however, a capacitor is formed while partially leavingside walls 100 consisting of silicon nitride films located between acapacitor lower electrode 170 a and a third interlayer isolation film77. The side walls 100 are so partially left that the surface area ofouter side surfaces of the capacitor lower electrode 170 a serving asthe capacitor can be changed by changing the amount of the left sidewalls 100. Thus, the capacitance of the capacitor can be changed withoutchanging the structure of the capacitor lower electrode 170 a. Further,the remaining parts of the side walls 100 also serve as parts of areinforcing member against a physical impact, whereby the capacitorlower electrode 170 a can be further effectively prevented from breakingby a physical impact in a cleaning step or the like.

With reference to FIG. 57, a method of fabricating the firstmodification of the DRAM according to the embodiment 4 of the presentinvention is now described.

First, fabrication steps identical to those for the DRAM according tothe embodiment 4 of the present invention shown in FIGS. 51 to 54 arecarried out, and thereafter the side walls 100 are partially removed byetching to be partially left, as shown in FIG. 57. In case of employingwet etching, only parts of the side walls 100 can be removed bycontrolling the time for dipping the same in an etching solution.

Thereafter a dielectric film 150 (see FIG. 56) and the like are formed,thereby obtaining the structure shown in FIG. 56.

Referring to FIG. 58, a second modification of the DRAM according to theembodiment 4 of the present invention is basically similar in structureto the DRAM according to the embodiment 4 shown in FIG. 50. In thesecond modification of the DRAM according to the embodiment 4 of thepresent invention shown in FIG. 58, however, clearances located betweena capacitor lower electrode 170 a and a third interlayer isolation film77 are so defined as to partially expose a bottom surface of thecapacitor lower electrode 170 a in a fabrication step described later.Thus, the exposed part of the bottom surface of the capacitor lowerelectrode 170 a also serves as a capacitor due to formation of adielectric film 150 and the like thereon. Thus, the capacitance of thecapacitor can be further increased.

With reference to FIG. 59, a method of fabricating the secondmodification of the DRAM according to the embodiment 4 of the presentinvention is now described.

First, fabrication steps identical to those for the DRAM according tothe embodiment 4 of the present invention shown in FIGS. 51 to 54 arecarried out, thereafter side walls 100 (see FIG. 54) located between thecapacitor lower electrode 170 a and the third interlayer isolation film77 are removed by etching, and thereafter etching is performed topartially remove a second interlayer isolation film 37 located under theside walls 100. Thus, clearances can be defined to expose outer sidesurfaces and the part of the bottom surface of the capacitor lowerelectrode 170 a. The remaining part of the bottom surface of thecapacitor lower electrode 170 a is in contact with the second interlayerisolation film 37 at this time, whereby the second interlayer isolationfilm 37 serves as a reinforcing member for preventing the capacitorlower electrode 170 a from breaking or the like against a physicalimpact in a cleaning step or the like which is thereafter carried out.

Then, the dielectric film 150 (see FIG. 58) and the like are formed,thereby obtaining the structure shown in FIG. 58.

Referring to FIG. 60, a third modification of the DRAM according to theembodiment 4 of the present invention is basically similar in structureto the DRAM according to the embodiment 4 shown in FIG. 50. In the thirdmodification of the DRAM according to the embodiment 4 of the presentinvention, however, granular crystals 74 are formed on inner sidesurfaces of a capacitor lower electrode 170 a. Therefore, the surfacearea of the capacitor lower electrode 170 a can be increased withoutincreasing its occupied area, thereby increasing the capacitance of thecapacitor. Consequently, the occupied area of the capacitor lowerelectrode 170 a can be reduced while ensuring a constant capacitorcapacitance. Thus, the semiconductor device can be refined.

With reference to FIGS. 61 to 63, a method of fabricating the thirdmodification of the DRAM according to the embodiment 4 of the presentinvention is now described.

First, fabrication steps identical to those for the DRAM according tothe embodiment 4 of the present invention shown in FIGS. 51 to 53 arecarried out, and thereafter the granular crystals 74 are formed on aconductor film 101 through a step similar to that employed in theembodiment 1 or the like. Thus, the structure shown in FIG. 61 isobtained.

Then, the conductor film 101 and the granular crystals 74 located on athird interlayer isolation film 77 are removed by etching, as shown inFIG. 62. CMP may be employed at this time.

Then, side walls 100 are removed from the interior of an opening 61 byetching, thereby defining clearances between the capacitor lowerelectrode 170 a and the third interlayer isolation film 77, as shown inFIG. 63.

Thereafter a dielectric film 150 (see FIG. 60) of the capacitor and thelike are formed, thereby obtaining the structure shown in FIG. 60.

Referring to FIG. 64, a fourth modification of the DRAM according to theembodiment 4 of the present invention is basically similar in structureto the DRAM according to the embodiment 4 shown in FIG. 50. In thefourth modification of the DRAM according to the embodiment 4 of thepresent invention, however, granular crystals 74 are formed on overallinner and outer side surfaces of a capacitor lower electrode 170 a.Therefore, the surface area of the capacitor lower electrode 170 a canbe further increased without increasing its occupied area. Thus, theoccupied area of the capacitor lower electrode 170 a can be furtherreduced as compared with the prior art while ensuring a constantcapacitor capacitance. Consequently, the semiconductor device can befurther refined.

After forming an opening 61, the width thereof may be increased byetching similarly to the embodiment 3, thereby reducing the width of athird interlayer isolation film 77 located between the capacitor lowerelectrode 170 a and another capacitor lower electrode to be smaller thanthe minimum working size formable by photolithography. Thus, thesemiconductor device can be implemented with higher density ofintegration.

With reference to FIG. 65, a method of fabricating the fourthmodification of the DRAM according to the embodiment 4 of the presentinvention shown in FIG. 64 is now described.

First, fabrication steps identical to those for the DRAM according tothe embodiment 4 of the present invention shown in FIGS. 51 to 55 arecarried out. Thereafter the granular crystals 74 (see FIG. 65) areformed on the surfaces of the capacitor lower electrode 170 a through astep identical to that employed in the embodiment 1 of the presentinvention. Thus, the structure shown in FIG. 65 is obtained.

Thereafter a dielectric film 150 (see FIG. 64) and the like are formed,thereby obtaining the structure shown in FIG. 64.

The first to fourth modifications of the embodiment 4 may be applied tothe embodiments 1 to 3, to attain similar effects.

Embodiment 5

Referring to FIG. 66, A DRAM according to an embodiment 5 of the presentinvention is basically similar in structure to the DRAM according to theembodiment 4 shown in FIG. 50. However, a capacitor lower electrode 105of the DRAM according to the embodiment 5 is in the form of a thickfilm. In the DRAM according to the embodiment 5 of the presentinvention, clearances are defined between side surfaces of the capacitorlower electrode 105 and a third interlayer isolation film 77 for forminga dielectric film 150 and a capacitor upper electrode 151 on the sidesurfaces of the capacitor lower electrode 105, whereby the capacitanceof the capacitor can be increased. Further, the clearances are definedonly between the side surfaces of the capacitor lower electrode 105 andthe third interlayer isolation film 77 in a fabrication step describedlater, whereby a bottom surface of the capacitor lower electrode 105 canbe brought into contact with a second interlayer isolation film 37 whiledefining such clearances. When a semiconductor substrate provided withthis semiconductor device is cleaned in the state defining theclearances, therefore, the second interlayer isolation film 37 which isin contact with the bottom surface of the capacitor lower electrode 105serves as a reinforcing member for preventing the capacitor lowerelectrode 105 from partial breaking caused by physical vibration in thecleaning step or the like.

Further, the capacitor lower electrode 105 is embedded in the thirdinterlayer isolation film 77, whereby no step is caused on an uppersurface of a fourth interlayer isolation film 205 between a memory cellregion and a peripheral circuit region or the like. In case of forming awiring layer consisting of aluminum or the like on the fourth interlayerisolation film 205 by photolithography, therefore, the pattern of thewiring layer is prevented from being blurred by such a step on the uppersurface of the fourth interlayer isolation film 205. Thus, the wiringlayer is prevented from disconnection or shorting resulting from ablurred pattern. Consequently, the semiconductor device can beimplemented with higher density of integration while ensuring thecapacitance of the capacitor and attaining high reliability.

In the embodiment 5, the width of an opening 61 may be increased byetching, for reducing the width of a part of the third interlayerisolation film 77 located between the capacitor lower electrode 105 andanother capacitor lower electrode to be smaller than the minimum workingsize formable by photolithography. Thus, the interval between thecapacitor lower electrode 105 and the other capacitor lower electrodecan be reduced as compared with the prior art. Consequently, thesemiconductor device can be implemented with higher density ofintegration.

With reference to FIGS. 67 to 69, a method of fabricating the DRAMaccording to the embodiment 5 of the present invention is now described.

First, fabrication steps identical to those for the DRAM according tothe embodiment 4 of the present invention shown in FIGS. 51 and 52 arecarried out, and thereafter a dielectric film 104 consisting ofamorphous silicon or the like is formed on the third interlayerisolation film 77 and in the opening 61, as shown in FIG. 67.

Then, a part of the dielectric film 104 located on the third interlayerisolation film 77 is removed by dry etching or CMP, thereby obtainingthe structure shown in FIG. 68. Thus, the capacitor lower electrode 105is formed.

Then, side walls 100 (see FIG. 68) are removed by etching as shown inFIG. 69, thereby defining the clearances between the capacitor lowerelectrode 105 and the third interlayer isolation film 77.

Thereafter the dielectric film 150 (see FIG. 66) and the like are formedon the surfaces of the capacitor lower electrode 105 and the thirdinterlayer isolation film 77, thereby obtaining the structure shown inFIG. 66. The peripheral circuit region is formed through fabricationsteps identical to those for the peripheral circuit region of the DRAMaccording to the embodiment 1 shown in FIGS. 3 to 13.

Referring to FIG. 70, a modification of the DRAM according to theembodiment 5 of the present invention is basically similar in structureto the DRAM according to the embodiment 5 shown in FIG. 66. In themodification of the DRAM according to the embodiment 5 of the presentinvention, however, granular crystals 74 are formed on surfaces of acapacitor lower electrode 105. In addition to the effect of the DRAMaccording to the embodiment 5 of the present invention shown in FIG. 66,therefore, the surface area of the capacitor lower electrode 105 can beincreased without increasing its occupied area. Thus, the capacitance ofthe capacitor can be increased. Therefore, the occupied area of thecapacitor lower electrode 105 can be reduced as compared with the priorart while ensuring a constant capacitor capacitance. Consequently, thesemiconductor device can be further refined.

With reference to FIG. 71, a method of fabricating the modification ofthe DRAM according to the embodiment 5 of the present invention is nowdescribed.

First, fabrication steps identical to those for the DRAM according tothe embodiment 5 of the present invention shown in FIGS. 67 to 69 arecarried out, and thereafter the granular crystals 74 are formed on thesurfaces of the capacitor lower electrode 105, as shown in FIG. 71.These granular crystals 74 are formed through a step similar to that forforming the granular crystals 74 in the DRAM according to the embodiment1.

Thereafter a dielectric film 150 (see FIG. 70) and the like are formedon a third interlayer isolation film 77 and the surfaces of thecapacitor lower electrode 105, thereby obtaining the structure shown inFIG. 70.

Embodiment 6

FIG. 72 is a sectional view of a DRAM according to an embodiment 6 ofthe present invention taken along the line 700—700 in the typical planview of the memory cell region of the DRAM shown in FIG. 1.

Referring to FIG. 72, a trench isolation oxide film 40 is formed on amajor surface of a semiconductor substrate 1 to enclose an active region39 in the memory cell region of the DRAM according to the embodiment 6of the present invention. Source/drain regions 201 b and 201 c areformed on the major surface of the semiconductor substrate 1. Further, agate electrode 43 b is formed on the major surface of the semiconductorsubstrate 1 through a gate insulating film 42 b. A silicon nitride film44 b is formed on the gate electrode 43 b. Side walls 46 c and 46 dconsisting of silicon nitride films are formed on side surfaces of thesilicon nitride film 44 b, the gate electrode 43 b and the gateinsulating film 42 b. A non-doped silicon oxide film 47 is formed on thesilicon nitride film 44 b, the side walls 46 c and 46 d and the majorsurface of the semiconductor substrate 1. A first interlayer isolationfilm 48 is formed on the non-doped silicon oxide film 47. A bit line 174consisting of a doped polysilicon film 52 and a refractory metalsilicide film 53 is formed on the first interlayer isolation film 48.Side walls 55 a and 55 b consisting of silicon nitride films are formedon side surfaces of the silicon nitride film 54 and the bit line 174. Asecond interlayer isolation film 37 is formed on the silicon nitridefilm 54, the side walls 55 a and 55 b and the first interlayer isolationfilm 48. The first and second interlayer isolation films 48 and 37 andthe non-doped silicon oxide film 47 are partially removed, therebyforming an opening 110. The second interlayer isolation film 37 isformed to extend from the memory cell region to a peripheral circuitregion. A capacitor lower electrode 112 consisting of amorphous siliconor polysilicon is formed in the opening 110 to partially extend upwardlybeyond the second interlayer isolation film 37. A dielectric film 150 isformed on the capacitor lower electrode 112 and the second interlayerisolation film 37. A capacitor upper electrode 151 is formed on thedielectric film 150. A third interlayer isolation film 205 is formed onthe capacitor upper electrode 151. The peripheral circuit region of theDRAM according to the embodiment 6 of the present invention is basicallysimilar in structure to that of the DRAM according to the embodiment 1shown in FIG. 2.

In the DRAM according to the embodiment 6 of the present invention, thecapacitor lower electrode 112 is partially embedded in the secondinterlayer isolation film 37. Therefore, the difference between thevertical positions of an upper surface of the second interlayerisolation film 37 and a top surface of the capacitor lower electrode 112can be reduced in the memory cell region as compared with the prior art.In case of forming the third interlayer isolation film 205 in the memorycell region and the peripheral circuit region, therefore, a step on anupper surface of the third interlayer isolation film 205 between thememory cell region and the peripheral circuit region can be reduced. Incase of forming a wiring layer consisting of aluminum or the like on thethird interlayer isolation film 205 by photolithography, consequently,the pattern of the wiring layer can be prevented from being blurred bysuch a step on the upper surface of the third interlayer isolation film205. Consequently, the wiring layer can be prevented from disconnectionor shorting resulting from a blurred pattern. Thus, the semiconductordevice can be implemented with higher density of integration whileensuring the capacitance of the capacitor and attaining highreliability.

Further, the capacitor lower electrode 112, the silicon nitride film 54and the side wall 55 b are in contact with each other as shown in FIG.72, whereby the silicon nitride film 54 and the side wall 55 b can beutilized as masks in an etching step for forming the opening 110 asdescribed later. Therefore, no step of patterning a resist pattern isnecessary for forming the contact hole 110 for connecting the capacitorlower electrode 112 with the source/drain region 201 b on the majorsurface of the semiconductor substrate 1, dissimilarly to the prior art.Thus, the number of fabrication steps can be reduced.

With reference to FIGS. 73 to 77, a method of fabricating the DRAMaccording to the embodiment 6 of the present invention is now described.

First, the trench isolation oxide film 40 (see FIG. 73) is formed on themajor surface of the semiconductor substrate 1 (see FIG. 73) to enclosethe active region 39. A silicon oxide film (not shown) for defining thegate insulating film 42 b is formed on the major surface of thesemiconductor substrate 1. A polysilicon film (not shown) for definingthe gate electrode 43 b is formed on the silicon oxide film. A siliconnitride film (not shown) is formed on the polysilicon film. A resistpattern (not shown) is formed on the silicon nitride film, and employedas a mask for partially removing the silicon nitride film, thepolysilicon film and the silicon oxide film by etching. Thus, the gateinsulating film 42 b (see FIG. 73), the gate electrode 43 b (see FIG.73) and the silicon nitride film 44 b (see FIG. 73) are formed.Thereafter the resist pattern is removed. Then, a silicon nitride film(not shown) is formed to cover the overall surface. This silicon nitridefilm is partially removed by anisotropic etching, thereby forming theside walls 46 c and 46 d (see FIG. 73) on the side surfaces of the gateinsulating film 42 b, the gate electrode 43 b and the silicon nitridefilm 44 b.

The non-doped silicon oxide film 47 (see FIG. 73) is formed to cover theoverall surface. The first interlayer isolation film 48 (see FIG. 73) isformed on the non-doped silicon oxide film 47. A doped polysilicon film(not shown) is formed on the first interlayer isolation film 48. Arefractory metal silicide film (not shown) is formed on the dopedpolysilicon film. A silicon nitride film (not shown) is formed on therefractory metal silicide film. A resist pattern (not shown) is formedon the silicon nitride film and thereafter employed as a mask forpartially removing the silicon nitride film, the refractory metalsilicide film and the doped polysilicon film, thereby forming the bitline 174 (see FIG. 73) consisting of the doped polysilicon film 52 (seeFIG. 73) and the refractory metal silicide film 53 (see FIG. 73) and thesilicon nitride film 54 (see FIG. 73). A silicon nitride film (notshown) is formed to cover the overall surface and thereafter partiallyremoved by anisotropic etching, thereby forming the side walls 55 a and55 b (see FIG. 73). The second interlayer isolation film 37 (see FIG.73) is formed on the silicon nitride film 54. A boron-doped siliconoxide film 60 (see FIG. 73) is formed on the second interlayer isolationfilm 37. Thus, the structure shown in FIG. 73 is obtained. Steps offabricating a field-effect transistor and a wiring layer in a peripheralcircuit region are similar to those for the field-effect transistor andthe wiring layer in the peripheral circuit region of the DRAM accordingto the embodiment 1 of the present invention.

Then, a resist pattern (not shown) is formed on the boron-doped siliconoxide film 60 and thereafter employed as a mask for partially removingthe boron-doped silicon oxide film 60, the second interlayer isolationfilm 37, the first interlayer isolation film 48 and the non-dopedsilicon oxide film 47, thereby forming the opening 110 (see FIG. 74). Inthe etching step for forming the opening 110, the silicon nitride films54 and 44 b and the side walls 55 b and 46 c are employed as parts ofthe mask, whereby the opening 110 can reach the source/drain region 201b in a self-alignment manner. Thereafter the resist pattern is removed,thereby obtaining the structure shown in FIG. 74.

The width of the opening 110 may be increased by isotropic etching.Thus, the width of a part of the second interlayer isolation film 37located between the opening 110 and another opening for anothercapacitor lower electrode can be reduced to be smaller than the minimumworking size formable by photolithography. In case of forming thecapacitor lower electrode 112 (see FIG. 72) in the opening 110,therefore, the interval between the capacitor lower electrode 112 andthe other capacitor lower electrode can be reduced as compared with theprior art. Consequently, the semiconductor device can be implementedwith higher density of integration.

Then, a conductor film 111 consisting of amorphous silicon or the likeis formed on the boron-doped silicon oxide film 60 and in the opening110, as shown in FIG. 75.

Then, the conductor film 111 (see FIG. 75) located on the boron-dopedsilicon oxide film 60 is removed by dry etching or CMP, thereby formingthe capacitor lower electrode 112, as shown in FIG. 76.

Then, the boron-doped silicon oxide film 60 (see FIG. 76) is removed byetching, as shown in FIG. 77.

Thereafter the dielectric film 150 (see FIG. 72) and the like are formedon the capacitor lower electrode 112 and the second interlayer isolationfilm 37, thereby obtaining the structure shown in FIG. 72.

Referring to FIG. 78, a first modification of the DRAM according to theembodiment 6 of the present invention is basically identical instructure to the DRAM according to the embodiment 6 shown in FIG. 72. Inthe first modification of the DRAM according to the embodiment 6 of thepresent invention, however, granular crystals 74 are formed on innerside surfaces of a capacitor lower electrode 112. Therefore, the surfacearea of the capacitor lower electrode 112 can be increased withoutincreasing its occupied area. Thus, the capacitance of the capacitor canbe increased. Consequently, the occupied area of the capacitor lowerelectrode 112 can be reduced while ensuring a constant capacitorcapacitance. Consequently, the semiconductor device can be furtherrefined.

In order to fabricate the first modification of the DRAM according tothe embodiment 6 of the present invention, fabrication steps identicalto those for the DRAM according to the embodiment 6 shown in FIGS. 73 to75 are carried out and thereafter a fabrication step identical to thatfor the third modification of the DRAM according to the embodiment 1shown in FIG. 22 is carried out. Thereafter fabrication steps identicalto those for the DRAM according to the embodiment 6 shown in FIGS. 76and 77 are carried out, thereby obtaining the structure shown in FIG.78.

Referring to FIG. 79, a second modification of the DRAM according to theembodiment 6 of the present invention is basically similar in structureto the DRAM according to the embodiment 6 shown in FIG. 72. In thesecond modification of the DRAM according to the embodiment 6 of thepresent invention shown in FIG. 79, however, granular crystals 74 areformed also on inner surfaces and outer side surfaces of a capacitorlower electrode 112. Therefore, the surface area of the capacitor lowerelectrode 112 can be increased without increasing its occupied area.Thus, the occupied area of the capacitor lower electrode 112 can befurther reduced while ensuring a constant capacitor capacitance.

With reference to FIG. 80, a method of fabricating the secondmodification of the DRAM according to the embodiment 6 of the presentinvention is now described.

First, fabrication steps identical to those for the DRAM according tothe embodiment 6 shown in FIGS. 73 to 77 are carried out, and thereafterthe granular crystals 74 (see FIG. 80) are formed on the surfaces of thecapacitor lower electrode 112. The granular crystals 74 are formedthrough a step similar to that for forming the granular crystals 74 inthe DRAM according to the embodiment 1 of the present invention. Thus,the structure shown in FIG. 80 is obtained.

Thereafter a dielectric film 150 (see FIG. 79) and the like are formedon the granular crystals 74 and a second interlayer isolation film 37,thereby obtaining the structure shown in FIG. 79.

Referring to FIG. 81, a third modification of the DRAM according to theembodiment 6 of the present invention is basically similar in structureto the DRAM according to the embodiment 6 shown in FIG. 72. In the thirdmodification of the DRAM according to the embodiment 6 of the presentinvention, however, a capacitor lower electrode 92 is in the form of athick film. The third modification of the DRAM according to theembodiment 6 of the present invention shown in FIG. 81 attains an effectsimilar to that of the DRAM according to the embodiment 6 shown in FIG.72.

In order to fabricate the third modification of the DRAM according tothe embodiment 6 of the present invention shown in FIG. 81, fabricationsteps identical to those for the DRAM according to the embodiment 6shown in FIGS. 73 and 74 are carried out and thereafter fabricationsteps identical to those for the DRAM according to the embodiment 2shown in FIGS. 28 and 29 are carried out. Thus, the structure shown inFIG. 81 is obtained.

Referring to FIG. 82, a fourth modification of the DRAM according to theembodiment 6 of the present invention is basically similar in structureto the third modification of the DRAM according to the embodiment 6shown in FIG. 81. In the fourth modification shown in FIG. 82, however,side walls 96 and 97 are formed on side surfaces of a capacitor lowerelectrode 92. Surfaces of the side walls 96 and 97 are at leastpartially curved. Therefore, the surface areas of the side surfaces ofthe capacitor lower electrode 92 can be increased as compared with thecase of forming no side walls 96 and 97. Thus, the capacitor capacitancecan be increased. Therefore, the occupied area of the capacitor lowerelectrode 92 can be reduced as compared with the prior art whileensuring a constant capacitor capacitance. Consequently, thesemiconductor device can be further refined.

In order to fabricate the fourth modification of the DRAM according tothe embodiment 6 of the present invention shown in FIG. 82, fabricationsteps identical to those for the DRAM according to the embodiment 6shown in FIGS. 73 and 74 are carried out, and thereafter fabricationsteps identical to those for the DRAM according to the embodiment 2shown in FIGS. 28 and 29 are carried out. Thereafter fabrication stepsidentical to those for the first modification of the DRAM according tothe embodiment 2 of the present invention shown in FIGS. 31 and 32 arecarried out. Thus, the structure shown in FIG. 82 is obtained.

Referring to FIG. 83, a fifth modification of the DRAM according to theembodiment 6 of the present invention, which is basically similar instructure to the fourth modification of the DRAM according to theembodiment 6 shown in FIG. 82, further comprises granular crystals 98 onsurfaces of side walls 96 and 97 formed on side surfaces of a capacitorlower electrode 92. In the fifth modification of the DRAM according tothe embodiment 6 of the present invention comprising the granularcrystals 98, therefore, the surface area of the capacitor lowerelectrode 92 can be further increased without increasing its occupiedarea. Therefore, the capacitance of the capacitor can be increased.Thus, the occupied area of the capacitor lower electrode 92 can bereduced as compared with the prior art while ensuring a constantcapacitor capacitance, and the semiconductor device can be furtherrefined.

In order to fabricate the fifth modification of the DRAM according tothe embodiment 6 of the present invention shown in FIG. 83, fabricationsteps identical to those for the DRAM according to the embodiment 6shown in FIGS. 73 and 74 are carried out, and thereafter fabricationsteps identical to those for the DRAM according to the embodiment 2shown in FIGS. 28 and 29 are carried out. Then, fabrication stepsidentical to those for the first modification of the DRAM according tothe embodiment 2 shown in FIGS. 31 and 32 are carried out, andthereafter a fabrication step identical to that for the thirdmodification of the DRAM according to the embodiment 2 shown in FIG. 36is carried out. Thus, the structure shown in FIG. 83 is obtained.

Referring to FIG. 84, a sixth modification of the DRAM according to theembodiment 6 of the present invention is basically similar in structureto the fifth modification of the DRAM according to the embodiment 6shown in FIG. 83. In the sixth modification shown in FIG. 84, however,granular crystals 98 are formed also on an upper surface of a capacitorlower electrode 92. Therefore, the surface area of the capacitor lowerelectrode 92 can be increased as compared with the prior art withoutincreasing its occupied area. Thus, an effect similar to that of thefifth modification of the DRAM according to the embodiment 6 of thepresent invention shown in FIG. 83 can be attained.

In order to fabricate the sixth modification of the DRAM according tothe embodiment 6 of the present invention shown in FIG. 84, afabrication step identical to that for the fifth modification of theDRAM according to the embodiment 6 shown in FIG. 83 is carried out forforming side walls 96 and 97 and thereafter a fabrication step identicalto that for the fourth modification of the DRAM according to theembodiment 2 shown in FIG. 38 is carried out, thereby obtaining thestructure shown in FIG. 84.

Embodiment 7

A memory cell region of a DRAM according to an embodiment 7 of thepresent invention is basically similar in structure to that of the DRAMaccording to the embodiment 1 shown in FIG. 1. In the DRAM according tothe embodiment 7 of the present invention, however, a bit line 174 issmaller in width than a contact hole 49. FIG. 86 shows a section takenalong the line 500—500 in FIG. 1. Referring to FIG. 86, the DRAMaccording to the embodiment 7 of the present invention is basicallysimilar in structure to the first modification of the DRAM according tothe embodiment 1 shown in FIG. 16. However, the DRAM according to theembodiment 7 of the present invention shown in FIG. 86 is so formed thatthe bit line 174 is smaller in width than the contact hole 49.

In addition to the effect of the first modification of the DRAMaccording to the embodiment 1 of the present invention shown in FIG. 16,therefore, the semiconductor device can be further refined as comparedwith the conventional case of increasing the width of the bit line 174to be larger than that of the contact hole 49.

The bit line 174 is directly in contact with a second interlayerisolation film 37, and no wire protection isolation film such as asilicon nitride film is formed therebetween. Therefore, the number oflayers formed in the memory cell region can be reduced as compared withthe general case of forming a wire protection isolation film on the bitline 174. Thus, the vertical position of an upper surface of a fourthinterlayer isolation film 205 can be lowered in the memory cell region,thereby further reducing a step on the upper surface of the fourthinterlayer isolation film 205 between the memory cell region and aperipheral circuit region. In case of forming a wiring layer consistingof aluminum or the like on the fourth interlayer isolation film 205 byphotolithography, therefore, the pattern of this wiring layer can beprevented from being blurred by such a step on the upper surface of thefourth interlayer isolation film 205. Thus, the wiring layer can beprevented from a defect such a disconnection or shorting, whereby thesemiconductor device can be implemented with higher density ofintegration while ensuring the capacitance of the capacitor andattaining high reliability.

While a method of fabricating the DRAM according to the embodiment 7 ofthe present invention shown in FIG. 86 is basically similar to that forthe first modification of the DRAM according to the embodiment 1 shownin FIG. 16, a refractory metal film 127 of titanium or the like and atungsten film 126 are formed in the contact hole 49 in a fabricationstep identical to that shown in FIG. 7. A resist pattern is formed onthe tungsten film 126 and thereafter employed as a mask for partiallyremoving the tungsten film 126 and the refractory metal film 127 byetching, thereby forming the bit line 174 shown in FIG. 86. No wireprotection isolation film such as a silicon nitride film is formed onthe bit line 174, whereby a surface of a second interlayer isolationfilm 37 can be readily flattened.

Referring to FIG. 87, a modification of the DRAM according to theembodiment 7 of the present invention is basically similar in structureto the DRAM according to the embodiment 7 shown in FIG. 86. In themodification of the DRAM according to the embodiment 7 of the presentinvention shown in FIG. 87, however, a plug 128 consisting ofphosphorus-doped polysilicon or the like is formed in a contact hole 49.A bit line 174 consisting of a refractory metal film 127 of titanium orthe like and a tungsten film 126 is formed on this plug 128. The bitline 174 is formed to be smaller in width than the contact hole 49.Thus, an effect similar to that of the DRAM according to the embodiment7 of the present invention shown in FIG. 86 is attained.

A method of fabricating the modification of the DRAM according to theembodiment 7 of the present invention shown in FIG. 87 is basicallysimilar to that for the DRAM according to the embodiment 7 shown in FIG.86. In a step of forming the bit line 174 of the modification of theDRAM according to the embodiment 7 shown in FIG. 86, however, the plug128 consisting of phosphorus-doped polysilicon is first formed in thecontact hole 49, for thereafter forming the bit line 174.

Embodiment 8

Referring to FIG. 88, a memory cell region of a DRAM according to anembodiment 8 of the present invention is basically similar in structureto the memory cell region of the DRAM according to the embodiment 1shown in FIG. 2. A peripheral circuit region of the DRAM according tothe embodiment 8 of the present invention is also basically similar instructure to the peripheral circuit region of the DRAM according to theembodiment 1 shown in FIG. 2. In the DRAM according to the embodiment 8of the present invention shown in FIG. 88, however, a contact hole 135is formed in the peripheral circuit region for connecting a wiring layerformed on a fourth interlayer isolation film 205 and a capacitor upperelectrode 151. Further, a dummy wiring layer 138 is formed on a regionlocated under the contact hole 135, for protecting a peripheral circuitelement such as a field-effect transistor in the peripheral circuitregion.

Even if the contact hole 135 passes through the capacitor upperelectrode 151 and a dielectric film 150 to reach a third interlayerisolation film 59 located under the same or the like in an etching stepfor forming the contact hole 135, the dummy wiring layer 138 consistingof a doped polysilicon film 52 and a refractory metal silicide film 53can stop progress of the etching. Consequently, the peripheral circuitelement located under the dummy wiring layer 138 can be prevented fromdamage by the etching. Thus, the semiconductor device can be preventedfrom a defective operation resulting from damage of the peripheralcircuit element. Consequently, a highly reliable semiconductor devicecan be obtained.

Fabrication steps for the DRAM according to the embodiment 8 of thepresent invention shown in FIG. 88 are basically similar to those forthe DRAM according to the embodiment 1 shown in FIGS. 3 to 14. However,the dummy wiring layer 138 is formed in a fabrication step identical tothat for the wiring layer 202 in the peripheral circuit region shown inFIG. 2.

Referring to FIG. 89, a first modification of the DRAM according to theembodiment 8 of the present invention is basically similar in structureto the DRAM according to the embodiment 8 shown in FIG. 88. In the firstmodification of the DRAM according to the embodiment 8 of the presentinvention shown in FIG. 89, however, no peripheral circuit elements suchas a wiring layer and a field-effect transistor are formed in a regionlocated under a contact hole 135 in a peripheral circuit region.

Even if the contact hole 135 passes through a capacitor upper electrode151 and the like to reach a third interlayer isolation film 59 locatedunder the same in an etching step for forming the contact hole 135,therefore, no peripheral circuit elements are damaged by this etching.

A method of fabricating the first modification of the DRAM according tothe embodiment 8 of the present invention shown in FIG. 89 is basicallysimilar to that for the DRAM according to the embodiment 8 of thepresent invention shown in FIG. 8. However, the contact hole 135 and theperipheral circuit elements are formed on regions not overlapping witheach other in plane.

Referring to FIG. 90, a memory cell region of a second modification ofthe DRAM according to the embodiment 8 of the present invention isbasically similar in structure to that of the DRAM according to theembodiment 8 shown in FIG. 88. In a peripheral circuit region, a thirdinterlayer isolation film 59 and a silicon nitride film 58 are partiallyremoved, thereby forming an opening 303. A dummy capacitor lowerelectrode 140 consisting of a material similar to that for a capacitorlower electrode 170 a of the memory cell region is formed in the opening303. A dielectric film 150 is formed on the third interlayer isolationfilm 59 and the dummy capacitor lower electrode 140. A capacitor upperelectrode 151 is formed on the dielectric film 150. The contact hole 135reaches the capacitor upper electrode 151 on a bottom portion of thedummy capacitor lower electrode 140.

Thus, the dummy capacitor lower electrode 140 is formed for forming thecontact hole 135 in the region located above the same, whereby the depthof the contact hole 135 can be made larger than that of the contact hole135 in the DRAM according to the embodiment 8 of the present inventionshown in FIG. 88. Thus, the difference between the depths of anothercontact hole (not shown) reaching a wiring layer 202 (see FIG. 2) in theperipheral circuit region and the contact hole 135 (see FIG. 90) of theDRAM according to the embodiment 8 of the present invention can bereduced. Consequently, the capacitor upper electrode 151 can beprevented from excessive etching on a bottom portion of the contact hole135 in an etching step for forming the contact hole 135. Thus, theetching can be prevented from passing through the capacitor upperelectrode 151 and reaching the second interlayer isolation film 37located under the same.

While a method of fabricating the second modification of the DRAMaccording to the embodiment 8 of the present invention shown in FIG. 90is basically similar to that for the first modification of the DRAMaccording to the embodiment 8 shown in FIG. 89, the dummy capacitorlower electrode 140 is formed simultaneously with the capacitor lowerelectrode 170 a in the memory cell region.

Referring to FIG. 91, a third modification of the DRAM according to theembodiment 8 of the present invention is basically similar in structureto the second modification of the DRAM according to the embodiment 8shown in FIG. 90. In the third modification of the DRAM according to theembodiment 8 of the present invention shown in FIG. 91, however, thehorizontal width of a dummy capacitor lower electrode 140 is reducedwhile the vertical thickness of a capacitor upper electrode 151 in thedummy capacitor lower electrode 140 is increased as compared with thatin the second modification shown in FIG. 90. A contact hole 135 isformed in an upper portion of the capacitor upper electrode 151 having alarge vertical thickness.

Thus, the vertical thickness of the capacitor upper electrode 151located under the contact hole 135 is so increased that the contact hole135 can be prevented from passing through the capacitor upper electrode151 and reaching a second interlayer isolation film 37 in an etchingstep for forming the contact hole 135. Further, the depth of the contacthole 135 can be arbitrarily changed by adjusting the width of an opening303 and the thickness of the capacitor upper electrode 151.

A method of fabricating the third modification of the DRAM according tothe embodiment 8 of the present invention shown in FIG. 91 is basicallysimilar to that for the second modification of the DRAM according to theembodiment 8 shown in FIG. 90.

In order to obtain a semiconductor device which can be implemented withhigh density of integration while ensuring a constant capacitorcapacitance and attaining high reliability, a wire having lowerresistance and a lower capacitance is required in a memory cell regionand a peripheral circuit region.

Referring to FIG. 118, a silicon nitride film 1002 is formed on a majorsurface of a semiconductor substrate 1001, in relation to a conventionalwire. A non-doped silicon oxide film 1143 is formed on the siliconnitride film 1002. The non-doped silicon oxide film 1143 and the siliconnitride film 1002 are partially removed, thereby forming an opening1003. A wire 1005 consisting of polysilicon is formed in the opening1003.

With reference to FIGS. 119 and 120, steps of fabricating theconventional wire 1005 are now described.

First, the silicon nitride film 1002 (see FIG. 119) is formed on themajor surface of the semiconductor substrate 1001 (see FIG. 119). Thesilicon nitride film 1002 may be replaced with a silicon oxi-nitridefilm or a film having a multilayer structure of a silicon nitride filmand a silicon oxi-nitride film. The non-doped silicon oxide film 1143(see FIG. 119) is formed on the silicon nitride film 1002. The non-dopedsilicon oxide film 1143 may be replaced with a silicon oxide film dopedwith phosphorus or boron. A resist pattern (not shown) is formed on thenon-doped silicon oxide film 1143 and thereafter employed as a mask forpartially removing the non-doped silicon oxide film 1143 and the siliconnitride film 1002, thereby forming the opening 1003 (see FIG. 119).Thus, the structure shown in FIG. 119 is obtained.

Then, a polysilicon film 1004 is formed on the non-doped silicon oxidefilm 1143 and in the opening 1003, as shown in FIG. 120. The polysiliconfilm 1004 may be replaced with an amorphous silicon film. Thepolysilicon film 1004 may be doped with phosphorus, arsenic or noimpurity. Further, the polysilicon film 1004 may be replaced with a filmof a refractory metal such as tungsten or titanium, or a silicide ofsuch a refractory metal. In addition, the polysilicon film 1004 may bereplaced with a metal film of copper or aluminum, or a multilayerstructure thereof.

Then, the polysilicon film 1004 located on the non-doped silicon oxidefilm 1143 is removed by etching or CMP, for obtaining the structureshown in FIG. 118.

FIG. 121 shows an exemplary structure of a second generally proposedwire. Referring to FIG. 121, a silicon nitride film 1002 is formed on amajor surface of a semiconductor substrate 1001, in relation to thesecond generally proposed wire. A non-doped silicon oxide film 1143 isformed on the silicon nitride film 1002. The non-doped silicon oxidefilm 1143 and the silicon nitride film 1002 are partially removed,thereby forming an opening 1003. A wire 1015 consisting of polysiliconis formed in the opening 1003. Granular crystals 1016 are formed onsurfaces of the wire 1015. Thus, the resistance of the wire 1015 can bereduced due to the granular crystals 1016 formed on its surfaces.

With reference to FIGS. 122 to 124, fabrication steps for the secondgenerally proposed wire 1015 are described.

The silicon nitride film 1002 (see FIG. 122) is formed on the majorsurface of the semiconductor substrate 1001 (see FIG. 122). Thenon-doped silicon oxide film 1143 (see FIG. 122) is formed on thesilicon nitride film 1002. A resist pattern (not shown) is formed on thenon-doped silicon oxide film 1143 and thereafter employed as a mask forpartially removing the non-doped silicon oxide film 1143 and the siliconnitride film 1002 by etching, thereby forming the opening 1003 (see FIG.122). Thereafter the resist pattern is removed. Thus, the structureshown in FIG. 122 is obtained.

Then, a conductor film 1014 consisting of polysilicon is formed in theopening 1003 and on the non-doped silicon oxide film 1143, as shown inFIG. 123.

Then, a part of the conductor film 1014 located on the non-doped siliconoxide film 1143 is removed by etching, thereby obtaining the structureshown in FIG. 124. Thereafter the granular crystals 1016 (see FIG. 121)are formed on the surfaces of the wire 1015 through a step similar tothat for the first modification of the DRAM according to the embodiment1 of the present invention. Thus, the structure shown in FIG. 121 isobtained.

While a low-resistance wire is proposed in general, deterioration ofdevice characteristics such as access delay resulting from increasedwire resistance is now coming into question in the generally proposedwire following refinement of the semiconductor device. Thus, furtherreduction of the resistance and the capacitance of the wire is required.In order to obtain a wire satisfying such requirement, the structureapplied to the shape of the capacitor lower electrode in the presentinvention can be applied. A modification of a wire in the DRAM accordingto the embodiment 8 of the present invention based on such an idea isnow described.

Referring to FIG. 92, a silicon nitride film 2 is formed on a majorsurface of a semiconductor substrate 1, in relation to a firstmodification of a wire of the DRAM according to the embodiment 8 of thepresent invention. A non-doped silicon oxide film 143 is formed on thesilicon nitride film 2. A wire 5 consisting of polysilicon is formed tobe partially embedded in the non-doped silicon oxide film 143 and thesilicon nitride film 2. Granular crystals 9 are formed on inner surfacesand outer side surfaces of the wire 5.

The wire 5 is thus formed to upwardly extend beyond an upper surface ofthe non-doped silicon oxide film 143, whereby the sectional area of thewire 5 can be increased while reducing its occupied area. Thus, theresistance of the wire 5 can be reduced. Further, the resistance of thewire 5 can be further reduced due to the granular crystals 9 formed onits surfaces.

With reference to FIGS. 93 to 96, fabrication steps for the firstmodification of the wire of the DRAM according to the embodiment 8 ofthe present invention are now described.

First, the silicon nitride film 2 (see FIG. 93) is formed on the majorsurface of the semiconductor substrate 1 (see FIG. 93). The non-dopedsilicon oxide film 143 (see FIG. 93) is formed on the silicon nitridefilm 2. A boron-doped silicon oxide film 6 (see FIG. 93) is formed onthe non-doped silicon oxide film 143. A resist pattern (not shown) isformed on the boron-doped silicon oxide film 6 and thereafter employedas a mask for partially removing the boron-doped silicon oxide film 6and the non-doped silicon oxide film 143 by anisotropic etching, therebyforming an opening 3 (see FIG. 93). Thereafter the resist pattern isremoved, thereby obtaining the structure shown in FIG. 93.

Then, a polysilicon film 4 is formed on the boron-doped silicon oxidefilm 6 and in the opening 3, as shown in FIG. 94.

Then, the polysilicon film 4 located on the boron-doped silicon oxidefilm 6 is removed by etching or CMP, thereby obtaining the structureshown in FIG. 95.

Then, the boron-doped silicon oxide film 6 is removed by etching,thereby obtaining the structure shown in FIG. 96.

Thereafter the granular crystals 9 (see FIG. 92) are formed on thesurfaces of the wire 5 with application of the step employed in thefirst modification of the DRAM according to the embodiment 1 of thepresent invention, thereby obtaining the structure shown in FIG. 92.

With reference to FIGS. 97 to 100, a modification of the method offabricating the first modification of the wire of the DRAM according tothe embodiment 8 of the present invention is now described.

A silicon nitride film 2 (see FIG. 97) is formed on a semiconductorsubstrate 1 (see FIG. 97). A non-doped silicon oxide film 143 (see FIG.97) is formed on the silicon nitride film 2. A resist pattern (notshown) is formed on the non-doped silicon oxide film 143 and thereafteremployed as a mask for partially removing the non-doped silicon oxidefilm 143 and the silicon nitride film 2 by anisotropic etching, therebyforming an opening 3 (see FIG. 97). Thus, the structure shown in FIG. 97is obtained.

Then, a polysilicon film 4 (see FIG. 98) is formed on the non-dopedsilicon oxide film 143 and in the opening 3. Thus, the structure shownin FIG. 98 is obtained.

Then, the polysilicon film 4 located on the non-doped silicon oxide film143 is removed by etching or CMP, thereby obtaining the structure shownin FIG. 99. A wire 5 is formed in the opening 3.

Then, an upper portion of the non-doped silicon oxide film 143 ispartially removed by wet etching with an HF aqueous solution, as shownin FIG. 100. The amount of removal of the non-doped silicon oxide film143 can be controlled by changing the time for dipping the same in theHF aqueous solution.

Thereafter granular crystals 9 are formed on surfaces of the wire 5,thereby obtaining the structure shown in FIG. 92.

Referring to FIG. 101, a silicon nitride film 2 is formed on a majorsurface of a semiconductor substrate 1 in relation to a secondmodification of the wire of the DRAM according to the embodiment 8 ofthe present invention. A non-doped silicon oxide film 143 is formed onthe silicon nitride film 2. A wire 15 consisting of polysilicon isformed to be partially embedded in the non-doped silicon oxide film 143and the silicon nitride film 2. Side walls 23 are formed on sidesurfaces of the wire 15 consisting of polysilicon. Thus, the sectionalarea of the wire 15 comprising the side walls 23 of polysilicon can beincreased. Thus, the resistance of the wire 15 can be further reduced.

With reference to FIGS. 102 to 104, fabrication steps for the secondmodification of the wire of the DRAM according to the embodiment 8 ofthe present invention are now described.

First, a fabrication step identical to that for the first modificationof the wire of the DRAM according to the embodiment 8 shown in FIG. 93is carried out, and thereafter a polysilicon film (not shown) is formedon a boron-doped silicon oxide film 6 (see FIG. 102) and in an opening 3(see FIG. 93). Thereafter the polysilicon film located on theboron-doped silicon oxide film 6 is removed, thereby forming the wire 15shown in FIG. 102.

Then, the boron-doped silicon oxide film 6 is removed by etching,thereby obtaining the structure shown in FIG. 103. Thus, parts 25 of theside surfaces of the wire 15 can be exposed.

Then, a polysilicon film 24 is formed to cover the overall surface, asshown in FIG. 104.

Then, the polysilicon film 24 is partially removed by anisotropicetching, thereby obtaining the structure shown in FIG. 101.

Referring to FIG. 105, a third modification of the wire of the DRAMaccording to the embodiment 8 of the present invention is basicallysimilar in structure to the second modification of the wire of the DRAMaccording to the embodiment 8 of the present invention shown in FIG.101. In the third modification shown in FIG. 105, however, a wire 304 ismade of amorphous silicon. Further, side walls 23 are also made ofamorphous silicon, and granular crystals 26 are formed on surfaces ofthe wire 304 and the side walls 23. Thus, the resistance of the wire 304can be further reduced due to the granular crystals 26 formed on thesurfaces of the wire 304 and the side walls 23.

In order to fabricate the third modification of the wire of the DRAMaccording to the embodiment 8 of the present invention, fabricationsteps identical to those shown in FIGS. 102 to 104 are carried out and astep identical to that for forming the granular crystals 74 in the firstmodification of the DRAM according to the embodiment 1 of the presentinvention is carried out, for obtaining the structure shown in FIG. 105.

Referring to FIG. 106, a fourth modification of the wire of the DRAMaccording to the embodiment 8 of the present invention is basicallysimilar in structure to the third modification shown in FIG. 105. In thefourth modification shown in FIG. 106, however, a wire 15 is made ofpolysilicon, and granular crystals 26 are formed on surfaces of sidewalls 23 made of amorphous silicon. Granular crystals 35 smaller thanthe granular crystals 26 are formed on an upper surface of the wire 15.Thus, an effect similar to that of the third modification of the wire ofthe DRAM according to the embodiment 8 of the present invention can beattained.

Referring to FIG. 107, a silicon nitride film 2 is formed on a majorsurface of a semiconductor substrate 1 in relation to a fifthmodification of the wire of the DRAM according to the embodiment 8 ofthe present invention. A non-doped silicon oxide film 143 is formed onthe silicon nitride film 2. A wire 30 consisting of polysilicon isformed to be embedded in the non-doped silicon oxide film 143 and thesilicon nitride film 2. Clearances 33 are defined between the wire 30,the non-doped silicon oxide film 143 and the silicon nitride film 2. Asilicon oxide film 32 is formed to cover the overall surface. Thus, aparasitic capacitance in the wire 30 can be reduced due to theclearances 33 defined on side surfaces thereof. Thus, the semiconductordevice can be prevented from delay in an access time resulting from aparasitic capacitance, as well as from deterioration of electriccharacteristics.

With reference to FIGS. 108 to 112, fabrication steps for the fifthmodification of the wire of the DRAM according to the embodiment 8 ofthe present invention are described.

First, the silicon nitride film 2 (see FIG. 108) is formed on the majorsurface of the semiconductor substrate 1 (see FIG. 108). A non-dopedsilicon oxide film 143 (see FIG. 108) is formed on the silicon nitridefilm 2. A resist pattern (not shown) is formed on the non-doped siliconoxide film 143 and thereafter employed as a mask for partially removingthe non-doped silicon oxide film 143 and the silicon nitride film 2 byetching, thereby forming an opening 3 (see FIG. 108). Thus, thestructure shown in FIG. 108 is obtained.

Then, an insulating film 27 (see FIG. 108) such as a silicon nitridefilm is formed on the non-doped silicon oxide film 143 and in theopening 3. Thus, the structure shown in FIG. 109 is obtained.

Then, the insulating film 27 is partially removed by anisotropicetching, thereby forming side walls 28 (see FIG. 110) in the opening 3.A polysilicon film 29 is formed on the non-doped silicon oxide film 143and in the opening 3, as shown in FIG. 110.

Then, a part of the polysilicon film 29 located on the non-doped siliconoxide film 143 is removed by anisotropic etching or CMP, therebyobtaining the structure shown in FIG. 111.

Then, the side walls 28 (see FIG. 111) are selectively removed byetching as shown in FIG. 112, thereby defining the clearances 33 on theside surfaces of the wire 30.

Thereafter a silicon oxide film 32 (see FIG. 107) which is inferior incoverage is formed to cover the overall surface, thereby obtaining thestructure shown in FIG. 107.

Referring to FIG. 113, a sixth modification of the wire of the DRAMaccording to the embodiment 8 of the present invention is basicallysimilar in structure to the fifth modification of the wire of the DRAMaccording to the embodiment 8 shown in FIG. 107. In the sixthmodification shown in FIG. 113, however, parts of side walls 28 remainunder clearances 33. Also in this structure, an effect similar to thatof the fifth modification of the wire of the DRAM according to theembodiment 8 of the present invention shown in FIG. 107 can be attained.

Fabrication steps for the sixth modification of the wire of the DRAMaccording to the embodiment 8 of the present invention shown in FIG. 113are basically similar to those for the fifth modification of the wire ofthe DRAM according to the embodiment 8 shown in FIGS. 108 to 112. In astep identical to that shown in FIG. 112, however, the side walls 28formed on side surfaces of a wire 30 are not entirely removed butpartially left.

The first to sixth modifications of the wire of the DRAM according tothe embodiment 8 are also applicable to the DRAMs according to theembodiments 1 to 7 of the present invention.

Although the present invention has been described and illustrated indetail, it is clearly understood that the same is by way of illustrationand example only and is not to be taken by way of limitation, the spiritand scope of the present invention being limited only by the terms ofthe appended claims.

What is claimed is:
 1. A semiconductor device including a memory cellregion and a peripheral circuit region, comprising: a semiconductorsubstrate having a major surface; an insulating film, having an uppersurface, being formed on said major surface of said semiconductorsubstrate to extend from said memory cell region to said peripheralcircuit region; a capacitor lower electrode being formed on said majorsurface of said semiconductor substrate to upwardly extend beyond saidupper surface of said insulating film in said memory cell region; and acapacitor upper electrode being formed on said capacitor lower electrodethrough a dielectric film to extend onto said upper surface of saidinsulating film, said capacitor lower electrode including a capacitorlower electrode part upwardly extending in opposition to said capacitorupper electrode and having a top surface and a bottom surface, saidupper surface of said insulating film being located between said topsurface and said bottom surface of said capacitor lower electrode part;and wherein the distance from said bottom surface of said capacitorlower electrode to said upper surface of said insulating film is longerthan the distance from said upper surface of said insulating film tosaid top surface of said capacitor lower electrode.
 2. The semiconductordevice in accordance with claim 1, wherein said capacitor lowerelectrode includes first and second capacitor lower electrodes, saidfirst and second capacitor lower electrodes are adjacent to each otherthrough a part of said insulating film in said memory cell region, andsaid part of said insulating film has a width being smaller than theminimum working size formable by photolithography.
 3. The semiconductordevice in accordance with claim 1, further comprising a side wallelectrode part being formed on a side surface of said capacitor lowerelectrode located upward beyond said upper surface of said insulatingfilm.
 4. The semiconductor device in accordance with claim 1, comprisingsaid dielectric film being formed between at least a side surface ofsaid capacitor lower electrode part and said insulating film.
 5. Thesemiconductor device in accordance with claim 1, further comprisinggranular crystals on a surface of said capacitor lower electrode.
 6. Thesemiconductor device in accordance with claim 1, further comprising: afirst wiring layer being formed on said major surface of saidsemiconductor substrate in a region located under said capacitor lowerelectrode, and a first interlayer isolation film being formed on saidfirst wiring layer to be in contact with said first wiring layer andsaid capacitor lower electrode part.
 7. The semiconductor device inaccordance with claim 1, further comprising: a first conductive regionbeing formed on said major surface of said semiconductor substrate in aregion located under said capacitor lower electrode, a first interlayerisolation film being formed on said first conductive region and having afirst contact hole exposing a surface of said first conductive region, afirst wiring layer being formed on said first interlayer isolation film,and a connecting conductor film being formed in said first contact holefor electrically connecting said first conductive region with said firstwiring layer, the width of said first wiring layer being smaller thanthat of said first contact hole.
 8. The semiconductor device inaccordance with claim 1, further comprising: a first conductive regionbeing formed on said major surface of said semiconductor substrate in aregion located under said capacitor lower electrode, a first interlayerisolation film being formed on said first conductive region and having afirst contact hole exposing a surface of said first conductive region, afirst wiring layer being formed on said first interlayer isolation film,a wire protection film being formed on said first wring layer, and aconductor film being formed in said first contact hole for electricallyconnecting said first conductive region with said capacitor lowerelectrode, said wire protection film being in contact with at least oneof said capacitor lower electrode and said conductor film.
 9. Thesemiconductor device in accordance with claim 1, further comprising:said capacitor upper electrode being formed to extend toward saidperipheral circuit region, a first interlayer isolation film beingformed on said capacitor upper electrode and having a first contact holeexposing a surface of said capacitor upper electrode, and a peripheralcircuit element protection film being formed under said insulating filmin a region located under said first contact hole.
 10. The semiconductordevice in accordance with claim 1, further comprising: a peripheralcircuit insulating film having a peripheral circuit region opening insaid peripheral circuit region, said capacitor upper electrode beingformed to extend into said peripheral circuit region opening, and afirst interlayer isolation film being formed on said peripheral circuitregion opening and having a first contact hole exposing a surface ofsaid capacitor upper electrode.
 11. The semiconductor device inaccordance with claim 1, comprising: said capacitor upper electrodebeing formed to extend toward said peripheral circuit region, a firstinterlayer isolation film being formed on said capacitor upper electrodeand having a first contact hole exposing a surface of said capacitorupper electrode, and a peripheral circuit element being formed undersaid insulating film in said peripheral circuit region, said firstcontact hold being formed in a region not overlapping with saidperipheral circuit element in plane.
 12. The semiconductor device inaccordance with claim 1, comprising said dielectric film being formedbetween at least only a part of said bottom surface of said capacitorlower electrode part and said insulating film.